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LM629N-6

Texas Instruments

LM629N-6 by Texas Instruments

LM629N-6 by Texas Instruments is a Motion Control IC with 28 terminals, operating at 5V. It features a rectangular package style and supports brush DC motor control applications. With a temperature range of -40 to 85°C, it is ideal for industrial use cases requiring precise motion control.

Median Price

$14.130

Lifecycle Status

Suppliers In-Stock

15

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1k+

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Rochester

USA . 1 parts In-Stock

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$14.130

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$12.640

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$11.900

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$11.900

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Digiode

USA . 4,931 parts In-Stock

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$14.906

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Digital Electronic Gebert Verwaltungs UG

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Nova Conductors

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MRC Electronics

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Holdelec - ElecDif-Pro

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Prism Electronics

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R&J Components

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Electronics Depot

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J & M Industries LLC

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ECAB

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Corohmni

South Africa . 264 parts In-Stock

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$1.720

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Parana Technologies

USA . 386 parts In-Stock

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$2.058

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$2.580

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DigiPath Technology Company

USA . 1,524 parts In-Stock

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$2.266

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ChromeModa Solutions

Germany . 6,790 parts In-Stock

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$2.312

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$1.896

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IDEA Electronic Components Group

UK . 2,194 parts In-Stock

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$2.081

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AZTECH Wire

Italy . 809 parts In-Stock

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Ampacity Inc.

Singapore . 1 parts In-Stock

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Semicontronic

India . 1 parts In-Stock

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$13.006

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$12.940

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Corphita

USA . 3,721 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$17.359

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Alle Elektronik GmbH

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Lixinc

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Kepictronics

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Overview

Unlock the power of precision motion control with the LM629N-6 by Texas Instruments. Crafted with quality materials and cutting-edge technology, this innovative motion control IC offers unparalleled performance and reliability. Ideal for a wide range of applications, from robotics to industrial automation, the LM629N-6 delivers precise control and seamless operation. Experience the value and benefits of Texas Instruments' expertise in motion control with the LM629N-6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the IC, making it suitable for industrial applications.

Nominal Supply Voltage (Vsup): 5 V

Operating at 5V allows for compatibility with standard power supplies, making it easy to integrate into existing systems.

No. of Terminals: 28

Having a high number of terminals allows for more flexibility in connecting the IC to various components in a motion control system.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this IC suitable for use in industrial environments where temperatures can vary.

Technology: NMOS

NMOS technology offers fast switching speeds and low power consumption, making this IC efficient for controlling brush DC motors.

Technical Specifications

Motion Control ICs LM629N-6 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

Length:

35.725 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.334 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

100 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

NMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

15.24 mm

Trade Compliance

LM629N-6 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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