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NFAM1012L5B

Onsemi

NFAM1012L5B by Onsemi

NFAM1012L5B by Onsemi is a BRUSHLESS DC MOTOR CONTROLLER IC with 39 terminals. It operates b/w -40 to 125 °C, suitable for AUTOMOTIVE applications. With a max output current of 10 A and Vsup range of 13.5-16.5 V, it's ideal for motion control in automotive systems.

Median Price

$23.660

Lifecycle Status

Suppliers In-Stock

8

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1k+

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Arrow

USA . 85 parts In-Stock

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USA . 85 parts In-Stock

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Chip1Stop

Japan . 85 parts In-Stock

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Digiode

USA . 600 parts In-Stock

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Vyrian

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Flip Electronics

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Bristol Electronics

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Dan-Mar Components

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Corphita

USA . 1,433 parts In-Stock

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AZTECH Wire

Italy . 556 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Component Stockers USA

USA . 208 parts In-Stock

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Problanco Electronics

Mexico . 6,333 parts In-Stock

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SupplyDigital Components

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UHIMA Technologies

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Overview

Revolutionize your motion control systems with the NFAM1012L5B by Onsemi, a cutting-edge Brushless DC Motor Controller that combines top-notch quality and exceptional performance. Designed for automotive applications, this rectangular-shaped IC boasts a wide operating temperature range and a maximum output current of 10 A, making it the perfect solution for your next project. Trust Onsemi's expertise in Motion Control ICs and experience the value and benefits that this product brings to your designs. Elevate your control systems with the NFAM1012L5B today!

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into existing circuit designs and layouts.

Nominal Supply Voltage (Vsup): 15 V

Optimal supply voltage for efficient and reliable operation of the motion control IC.

No. of Terminals: 39

Sufficient number of terminals for connecting various components and peripherals.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the IC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in diverse applications.

Terminal Position: DUAL

Dual terminal position facilitates easy installation and connection of the IC.

Maximum Seated Height: 7.1 mm

Low seated height enables compact and space-saving designs.

Width (mm): 31 mm

Moderate width for ease of integration and mounting within electronic systems.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Specific type for controlling brushless DC motors, providing precise and efficient motor control.

Minimum Supply Voltage (Vsup): 13.5 V

Low minimum supply voltage allows for operation in low-power scenarios.

Length: 54.5 mm

Adequate length for accommodating necessary components and circuits.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability in automotive applications.

Maximum Supply Current (Isup): 7 mA

Low supply current requirement minimizes power consumption and heat dissipation.

Maximum Output Current: 10 A

High output current capability for driving powerful motors and loads.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for easy and secure soldering on circuit boards.

Terminal Pitch: 0.89 mm

Fine terminal pitch allows for precise and compact PCB layout.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage tolerance for robust operation in varying voltage conditions.

Technical Specifications

Motion Control ICs NFAM1012L5B attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDMA-T39

Length:

54.5 mm

No. of Functions:

1

No. of Terminals:

39

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

MODULE,39LEAD,1.4

Package Shape:

Maximum Seated Height:

7.1 mm

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

.89 mm

Terminal Position:

DUAL

Width (mm):

31 mm

Trade Compliance

NFAM1012L5B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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