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NFAM1012L5BT

Onsemi

NFAM1012L5BT by Onsemi

NFAM1012L5BT by Onsemi is a Motion Control IC with 39 terminals, operating b/w -40 to 125 °C. It has a max output current of 10 A and supports brushless DC motor control applications. With a nominal voltage range of 13.5-16.5 V, it is ideal for automotive-grade systems requiring precise motion control at low power consumption levels.

Median Price

$26.200

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 80 parts In-Stock

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$24.840

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$24.840

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Verical

USA . 80 parts In-Stock

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$24.840

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$24.840

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Chip1Stop

Japan . 80 parts In-Stock

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$26.200

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$26.200

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DigiKey

USA . 90 parts In-Stock

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$27.130

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$27.130

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Flip Electronics (Authorized)

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Rochester

USA . 57 parts In-Stock

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$30.490

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$27.280

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$25.670

57

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$27.280

$25.670

Distributors (In-Stock)

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Digiode

USA . 1,213 parts In-Stock

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$23.598

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Vyrian

USA . 6,543 parts In-Stock

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USA . 90 parts In-Stock

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Corphita

USA . 575 parts In-Stock

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$22.356

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Corohmni

South Africa . 269 parts In-Stock

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$24.840

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SupplyDigital Components

Austria . 7,920 parts In-Stock

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Problanco Electronics

Mexico . 7,392 parts In-Stock

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TANS Electronics

Latvia . 4,838 parts In-Stock

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Kulean Microsystems

USA . 2,205 parts In-Stock

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Perfect Parts

USA . 1,478 parts In-Stock

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UHIMA Technologies

Türkiye . 883 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 330 parts In-Stock

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Overview

Experience exceptional quality and performance with the NFAM1012L5BT by Onsemi, a leading manufacturer in motion control ICs. This versatile product offers a wide range of applications in various industries, providing precise control and reliability. With its advanced features and automotive-grade temperature grade, customers can trust in the value and benefits that this BRUSHLESS DC MOTOR CONTROLLER brings to their projects. Upgrade your motion control systems today with the NFAM1012L5BT and elevate your performance to new heights.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various systems and designs.

Nominal Supply Voltage (Vsup): 15 V

Ideal voltage range for efficient and consistent operation without causing damage to the IC.

No. of Terminals: 39

Sufficient number of terminals for connectivity and control options.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance ensures reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Low operating temperature tolerance allows for usage in extreme cold conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and electrical conductivity.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connection configurations.

Maximum Seated Height: 7.1 mm

Low seated height enables compact and space-efficient designs.

Width (mm): 31 mm

Moderate width allows for easy placement and integration into various systems.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Specifically designed for controlling brushless DC motors for efficient and precise motion control.

Minimum Supply Voltage (Vsup): 13.5 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Length: 54.5 mm

Optimal length for accommodating components and connections without taking up excessive space.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability and durability in automotive applications.

Maximum Supply Current (Isup): 7 mA

Low supply current requirement for energy-efficient operation.

Maximum Output Current: 10 A

High output current capability for driving motors and other loads effectively.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and stable connections on PCBs.

Terminal Pitch: 0.89 mm

Narrow terminal pitch allows for close placement of terminals on PCBs for compact designs.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage for flexibility in power supply options.

Technical Specifications

Motion Control ICs NFAM1012L5BT attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-XDMA-T39

JESD-609 Code:

e3

Length:

54.5 mm

No. of Functions:

1

No. of Terminals:

39

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

10 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

MODULE,39LEAD,1.4

Package Shape:

Maximum Seated Height:

7.1 mm

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

.89 mm

Terminal Position:

DUAL

Width (mm):

31 mm

Trade Compliance

NFAM1012L5BT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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