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STK681-332-E

Onsemi

STK681-332-E by Onsemi

STK681-332-E by Onsemi is a Motion Control IC with 5V nominal voltage, 12A max output current, and 19 terminals in FLANGE MOUNT package. Ideal for BRUSH DC MOTOR CONTROL applications due to its HYBRID technology and 4.75-5.25V operating range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,684 parts In-Stock

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Vyrian

USA . 1,102 parts In-Stock

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Ampacity Inc.

Singapore . 1,424 parts In-Stock

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$4.500

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$4.500

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Semicontronic

India . 517 parts In-Stock

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$4.500

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$4.388

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$4.365

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517

$4.500

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$4.365

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Vigor

Singapore . 2,530 parts In-Stock

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$8.120

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$8.120

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AZTECH Wire

Italy . 754 parts In-Stock

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$18.643

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754

$18.643

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Modulus Dynamics

Lithuania . 1,313 parts In-Stock

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$19.762

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$19.762

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$19.762

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$19.762

$19.762

$19.762

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Aztec Data Supply Inc.

USA . 180 parts In-Stock

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$22.810

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$22.810

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$24.370

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$23.151

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$23.151

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100

$24.370

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$23.151

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QUARKTWIN TECHNOLOGY LTD

USA . 9,867 parts In-Stock

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Kulean Microsystems

USA . 6,930 parts In-Stock

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Problanco Electronics

Mexico . 6,556 parts In-Stock

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Continental Prestige Electronics

USA . 4,462 parts In-Stock

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Microchip USA

USA . 3,808 parts In-Stock

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RC Electronics

USA . 3,185 parts In-Stock

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Lixinc

USA . 2,330 parts In-Stock

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TANS Electronics

Latvia . 2,166 parts In-Stock

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Argo Parts USA

USA . 1,810 parts In-Stock

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Corphita

USA . 1,734 parts In-Stock

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SupplyDigital Components

Austria . 773 parts In-Stock

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Kepictronics

USA . 166 parts In-Stock

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UHIMA Technologies

Türkiye . 156 parts In-Stock

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Corohmni

South Africa . 156 parts In-Stock

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Bastille Electronics

Australia . 53 parts In-Stock

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Overview

Enhance your motion control applications with the STK681-332-E by Onsemi. Designed with precision and quality in mind, this brush DC motor controller offers seamless operation and reliable performance. Onsemi, a trusted manufacturer in the industry, ensures that this product meets the highest standards for efficiency and durability. With a maximum output current of 12A and a nominal supply voltage of 5V, the STK681-332-E provides unmatched value and benefits to customers looking to optimize their motion control systems. Upgrade your projects today with this innovative IC and experience the difference in performance it brings.

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design for easy integration into any system.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage ensures compatibility with a wide range of applications, making it a versatile choice.

Power Supplies (V): 5,24

With both 5V and 24V power supplies supported, this IC can be used in various voltage environments, increasing its flexibility.

No. of Terminals: 19

The 19 terminals provide ample connection options for interfacing with other components, enabling seamless integration.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and stable operation in high-vibration environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish ensures reliable connections and long-term durability, making this IC a dependable choice.

Terminal Position: ZIG-ZAG

The zig-zag terminal position allows for efficient routing of connections, optimizing space and enhancing performance.

Other IC type: BRUSH DC MOTOR CONTROLLER

As a brush DC motor controller, this IC offers precise control and efficient operation for motor control applications.

Minimum Supply Voltage (Vsup): 4.75 V

The 4.75V minimum supply voltage ensures reliable operation even in low voltage conditions, improving overall reliability.

Maximum Supply Current (Isup): 9 mA

With a low maximum supply current of 9mA, this IC offers energy-efficient operation, reducing power consumption.

Maximum Output Current: 12 A

The high maximum output current of 12A allows for driving high-power loads, making this IC suitable for demanding applications.

Technology: HYBRID

The hybrid technology used in this IC combines the advantages of different technologies, resulting in optimal performance and reliability.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enables easy soldering and secure connections, simplifying the assembly process.

Terminal Pitch: 1 mm

The 1mm terminal pitch provides precise spacing for connections, ensuring proper alignment and reducing the risk of errors.

Maximum Supply Voltage (Vsup): 5.25 V

The 5.25V maximum supply voltage offers a safety margin for voltage fluctuations, enhancing the longevity of the IC.

Technical Specifications

Motion Control ICs STK681-332-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO REQUIRED 10V TO 38V AND 10V TO 42V

Other IC type:

JESD-30 Code:

R-XZFM-T19

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

19

Maximum Output Current:

12 A

Package Body Material:

UNSPECIFIED

Package Code:

ZIP

Package Equivalence Code:

ZIP19,.16,40

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

5,24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

9 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

STK681-332-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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