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STK621-070

Onsemi

STK621-070 by Onsemi

STK621-070 by Onsemi is a BRUSHLESS DC MOTOR CONTROLLER with 20A output current. It features HYBRID technology in RECTANGULAR package style with 18 terminals for FLANGE MOUNT. Ideal for motion control applications requiring high current and precise motor control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,989 parts In-Stock

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1,989

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Vyrian

USA . 1,127 parts In-Stock

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1,127

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Distributors (Availability)

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Corohmni

South Africa . 1,077 parts In-Stock

1+ parts

$21.986

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1,077

$21.986

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TANS Electronics

Latvia . 8,128 parts In-Stock

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8,128

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Problanco Electronics

Mexico . 7,780 parts In-Stock

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7,780

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Kulean Microsystems

USA . 7,447 parts In-Stock

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7,447

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SupplyDigital Components

Austria . 5,074 parts In-Stock

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5,074

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UHIMA Technologies

Türkiye . 567 parts In-Stock

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567

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Corphita

USA . 348 parts In-Stock

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348

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Overview

Enhance your motion control systems with the STK621-070 by Onsemi. Known for their high-quality manufacturing, Onsemi delivers reliable and innovative solutions for motion control applications. This BRUSHLESS DC MOTOR CONTROLLER offers a maximum output current of 20A, making it perfect for a wide range of industrial and robotics applications. With its HYBRID technology and FLANGE MOUNT package style, this IC provides superior performance and efficiency, giving you the competitive edge you need. Upgrade your systems today with the STK621-070 and experience the difference in precision and reliability.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement on PCBs and efficient use of space.

No. of Terminals: 18

Sufficient number of terminals for connecting various components and sensors, providing flexibility in design.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure attachment to external systems, ensuring stability during operation.

Terminal Position: SINGLE

Single terminal position simplifies connections and reduces chances of wiring errors.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Specialized IC type designed for efficient control of brushless DC motors, providing smooth and precise motion control.

Maximum Output Current: 20 A

High maximum output current allows for driving powerful motors, making it suitable for applications requiring high torque.

Technology: HYBRID

Hybrid technology combines the benefits of different types of technologies, offering a balance of performance, efficiency, and reliability.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and robust connections, suitable for industrial environments where vibrations or shocks are present.

Technical Specifications

Motion Control ICs STK621-070 attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-XSFM-T18

No. of Functions:

1

No. of Terminals:

18

Maximum Output Current:

20 A

Package Body Material:

UNSPECIFIED

Package Code:

SFM

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Surface Mount:

NO

Technology:

HYBRID

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trade Compliance

STK621-070 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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