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STK625-738-E

Onsemi

STK625-738-E by Onsemi

STK625-738-E by Onsemi is a Motion Control IC with 15V supply voltage, 21 terminals, and 4mA max supply current. It operates b/w -20 °C to 100°C, featuring HYBRID technology in a RECTANGULAR PLASTIC/EPOXY package. Ideal for applications requiring precise motion control in various industries.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,744 parts In-Stock

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Digiode

USA . 313 parts In-Stock

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313

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Corohmni

South Africa . 2,718 parts In-Stock

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$6.238

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2,718

$6.238

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Kulean Microsystems

USA . 6,598 parts In-Stock

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SupplyDigital Components

Austria . 6,409 parts In-Stock

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Problanco Electronics

Mexico . 5,218 parts In-Stock

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Corphita

USA . 2,362 parts In-Stock

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TANS Electronics

Latvia . 2,345 parts In-Stock

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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Overview

Elevate your motion control applications with the STK625-738-E by Onsemi. Crafted with precision and quality in mind, this motion control IC offers unparalleled performance and reliability. Whether you're looking to enhance robotics, automation systems, or CNC machines, this product delivers exceptional value with its advanced technology and innovative design. Trust Onsemi, a reputable manufacturer known for pushing the boundaries of motion control ICs. Unlock new possibilities and take your projects to the next level with the STK625-738-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the product lightweight and durable, ideal for applications where weight and longevity are important.

Nominal Supply Voltage (Vsup): 15 V

Operating at a nominal supply voltage of 15V ensures compatibility with a wide range of systems and power sources, making it versatile for various applications.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this product can withstand high heat conditions, making it suitable for industrial environments that require reliable performance in elevated temperatures.

Technology: HYBRID

The use of hybrid technology combines the advantages of different semiconductor technologies, offering high performance, efficiency, and reliability in one package.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, reducing the risk of intermittent connections or damage during installation or operation.

Technical Specifications

Motion Control ICs STK625-738-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PZIP-T21

No. of Terminals:

21

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP21/29H,.2,1.1FL

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

15

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4 mA

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

STK625-738-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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