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STK672-740AN-E

Onsemi

STK672-740AN-E by Onsemi

STK672-740AN-E by Onsemi is a Motion Control IC with 19 terminals, 5V nominal voltage, and 20A max output current. It is a Stepper Motor Controller in rectangular package style for applications requiring precise motion control.

Median Price

$7.330

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 790 parts In-Stock

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$7.330

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$7.180

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$7.040

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790

$7.330

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$7.040

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Chip Stock

USA . 65,000 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

Japan . 800 parts In-Stock

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Vigor

Singapore . 67 parts In-Stock

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$6.000

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AZTECH Wire

Italy . 65 parts In-Stock

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$13.760

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TANS Electronics

Latvia . 7,019 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,518 parts In-Stock

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Kulean Microsystems

USA . 6,294 parts In-Stock

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SupplyDigital Components

Austria . 5,999 parts In-Stock

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Microchip USA

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Lixinc

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Argo Parts USA

USA . 4,079 parts In-Stock

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Continental Prestige Electronics

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Problanco Electronics

Mexico . 3,424 parts In-Stock

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Corphita

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Aranea Global

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UHIMA Technologies

Türkiye . 422 parts In-Stock

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Corohmni

South Africa . 130 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precise motion control with the STK672-740AN-E by Onsemi. Crafted with superior quality and cutting-edge technology, this stepper motor controller offers unparalleled performance and reliability. Ideal for a wide range of applications, from robotics to automation systems, this motion control IC delivers seamless operation and maximum efficiency. Experience the value of smooth motion control with the STK672-740AN-E, your ultimate solution for all your motion control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the internal components of the Motion Control ICs, making it suitable for various environments.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 19

Having 19 terminals allows for multiple connections and configurations, providing flexibility in design and functionality.

Maximum Output Current: 20 A

The high maximum output current of 20A makes this Motion Control IC ideal for applications that require significant power handling capabilities.

Technology: HYBRID

The hybrid technology used in this IC combines the advantages of different technologies, offering improved performance and efficiency in controlling motion.

Technical Specifications

Motion Control ICs STK672-740AN-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH THE RANGE OF 0V TO 42V SUPPLY, SEATED HT-CALCULATED

Other IC type:

JESD-30 Code:

R-PZIP-T19

JESD-609 Code:

e3

Length:

29.2 mm

No. of Functions:

1

No. of Terminals:

19

Maximum Output Current:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, HEAT SINK/SLUG, SHRINK PITCH

Maximum Seated Height:

18.2 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

HYBRID

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Width (mm):

4.5 mm

Trade Compliance

STK672-740AN-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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