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NCV7471BDQ5R2G

Onsemi

NCV7471BDQ5R2G by Onsemi

NCV7471BDQ5R2G by Onsemi is a dual-function network interface IC with CAN FD and LIN transceivers. It operates at 5V, supports data rates up to 2 Mbps, and is AEC-Q100 qualified for automotive applications. The package style is small outline with a heat sink, suitable for surface mount assembly in harsh environments.

Median Price

$3.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 340 parts In-Stock

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-

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$3.000

1k+ parts

$2.860

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340

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$3.000

$2.860

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Distributors (In-Stock)

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Digiode

USA . 1,097 parts In-Stock

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$2.660

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1,097

$2.660

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Chip Stock

USA . 69,000 parts In-Stock

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Vyrian

USA . 6,899 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 860 parts In-Stock

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$2.520

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860

$2.520

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Vigor

Singapore . 729 parts In-Stock

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$2.670

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729

$2.670

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Corohmni

South Africa . 367 parts In-Stock

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$2.870

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367

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AZTECH Wire

Italy . 597 parts In-Stock

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$17.580

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597

$17.580

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QUARKTWIN TECHNOLOGY LTD

USA . 7,822 parts In-Stock

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7,822

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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TANS Electronics

Latvia . 4,386 parts In-Stock

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Microchip USA

USA . 4,041 parts In-Stock

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4,041

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SupplyDigital Components

Austria . 2,626 parts In-Stock

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Kulean Microsystems

USA . 1,543 parts In-Stock

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1,543

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Problanco Electronics

Mexico . 690 parts In-Stock

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690

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UHIMA Technologies

Türkiye . 506 parts In-Stock

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iodParts Technologies Inc.

India . 44 parts In-Stock

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Overview

Enhance your automotive applications with the NCV7471BDQ5R2G from Onsemi. This high-quality network interface offers reliability and efficiency, thanks to its AEC-Q100 screening level and innovative technology. With dual transceivers for CAN FD and LIN communication, this product provides seamless connectivity and optimal performance. Trust Onsemi's expertise in delivering top-notch components for your automotive needs. Get the best value and benefits for your projects with the NCV7471BDQ5R2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reduces the overall weight of the product, making it suitable for automotive applications where weight is a critical factor.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single device can help save space on the PCB and reduce the overall component count.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures that the product meets automotive industry requirements for reliability and performance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the product to withstand harsh automotive environments without compromising performance.

No. of Terminals: 36

Having a higher number of terminals provides more connectivity options and flexibility in designing the PCB layout.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

The package style design helps in efficient heat dissipation and space-saving on the PCB.

Nominal Supply Voltage: 5 V

Operating at a commonly used supply voltage of 5V makes integration into existing systems easier.

Data Rate: 2 Mbps

High data rate capability enables fast and reliable communication in automotive networks.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level indicates how sensitive the product is to moisture during storage and assembly, ensuring product reliability.

Technical Specifications

Network Interfaces NCV7471BDQ5R2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

2 Mbps

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

36

No. of Transceivers:

2

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

NCV7471BDQ5R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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