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CYP15G0101DXB-BBXI

Infineon Technologies

CYP15G0101DXB-BBXI by Infineon Technologies

CYP15G0101DXB-BBXI by Infineon Technologies is a network interface with 100 terminals, operating at 3.3V. It features a data rate of 1500 Mbps and uses BICMOS technology for industrial applications. The package style is grid array, low profile, with a square shape and terminal finish of tin silver copper.

Median Price

$195.410

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 306 parts In-Stock

1+ parts

$173.512

100+ parts

$158.689

1k+ parts

$158.447

10k+ parts

-

306

$173.512

$158.689

$158.447

-

Rochester

USA . 11,440 parts In-Stock

1+ parts

$195.410

100+ parts

$183.690

1k+ parts

$171.960

10k+ parts

-

11,440

$195.410

$183.690

$171.960

-

Verical

USA . 11,440 parts In-Stock

1+ parts

-

100+ parts

$229.613

1k+ parts

$214.950

10k+ parts

-

11,440

-

$229.613

$214.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 1 parts In-Stock

1+ parts

$95.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$95.000

-

-

-

DF Sales Co.

USA . 1 parts In-Stock

1+ parts

$95.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$95.000

-

-

-

Digiode

USA . 439 parts In-Stock

1+ parts

$164.836

100+ parts

-

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-

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439

$164.836

-

-

-

Nova Conductors

Japan . 800 parts In-Stock

1+ parts

$237.760

100+ parts

-

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-

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800

$237.760

-

-

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Vyrian

USA . 3,053 parts In-Stock

1+ parts

-

100+ parts

-

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3,053

-

-

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Chip Stock

USA . 986 parts In-Stock

1+ parts

-

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-

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986

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 25 parts In-Stock

1+ parts

$7.228

100+ parts

-

1k+ parts

-

10k+ parts

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25

$7.228

-

-

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Modulus Dynamics

Lithuania . 4,391 parts In-Stock

1+ parts

$8.512

100+ parts

$8.172

1k+ parts

$7.831

10k+ parts

-

4,391

$8.512

$8.172

$7.831

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Aztec Data Supply Inc.

USA . 4,456 parts In-Stock

1+ parts

$15.830

100+ parts

-

1k+ parts

-

10k+ parts

-

4,456

$15.830

-

-

-

Component Stockers USA

USA . 479 parts In-Stock

1+ parts

$106.910

100+ parts

$106.910

1k+ parts

-

10k+ parts

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479

$106.910

$106.910

-

-

Ampacity Inc.

Singapore . 3,749 parts In-Stock

1+ parts

$147.490

100+ parts

-

1k+ parts

-

10k+ parts

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3,749

$147.490

-

-

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Semicontronic

India . 3,717 parts In-Stock

1+ parts

$147.490

100+ parts

$143.803

1k+ parts

$143.065

10k+ parts

-

3,717

$147.490

$143.803

$143.065

-

Corphita

USA . 43 parts In-Stock

1+ parts

$156.161

100+ parts

-

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-

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43

$156.161

-

-

-

Continental Prestige Electronics

USA . 6,375 parts In-Stock

1+ parts

$188.860

100+ parts

-

1k+ parts

-

10k+ parts

$185.083

6,375

$188.860

-

-

$185.083

Lixinc

USA . 16,498 parts In-Stock

1+ parts

-

100+ parts

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16,498

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-

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A-Z Elektronik GmbH

Germany . 4,514 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,514

-

-

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Argo Parts USA

USA . 3,660 parts In-Stock

1+ parts

-

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3,660

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Alle Elektronik GmbH

Germany . 3,009 parts In-Stock

1+ parts

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3,009

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$233.005

1k+ parts

$225.872

10k+ parts

$221.117

2,000

-

$233.005

$225.872

$221.117

Microchip USA

USA . 1,965 parts In-Stock

1+ parts

-

100+ parts

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1,965

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Kepictronics

USA . 200 parts In-Stock

1+ parts

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100+ parts

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200

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RC Electronics

USA . 110 parts In-Stock

1+ parts

-

100+ parts

$249.670

1k+ parts

$227.890

10k+ parts

$221.050

110

-

$249.670

$227.890

$221.050

GreenTree Electronics

Israel . 91 parts In-Stock

1+ parts

-

100+ parts

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91

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Perfect Parts

USA . 37 parts In-Stock

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37

-

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Overview

Experience seamless connectivity and unparalleled performance with the CYP15G0101DXB-BBXI by Infineon Technologies. As a trusted leader in the industry, Infineon Technologies ensures top-quality network interfaces that deliver reliable and efficient connections for a wide range of applications. Whether you're looking to enhance your networking capabilities or streamline your communication systems, this product offers unmatched value, benefits, and advantages. Trust in Infineon Technologies to provide cutting-edge solutions that elevate your technology experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy in the package body material makes this product lightweight and durable.

Surface Mount: YES

With surface mount capability, this product can be easily and securely mounted onto circuit boards, saving space and improving overall design aesthetics.

Package Shape: SQUARE

The square package shape allows for easy integration into various system layouts, enabling flexibility in design options.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V, this product offers compatibility with a wide range of power sources commonly found in networking applications.

No. of Terminals: 100

With 100 terminals, this product provides ample connectivity options for complex network setups, ensuring efficient data transmission.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile design of this package style maximizes space utilization on the circuit board, ideal for compact networking equipment.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can withstand extreme cold conditions without compromising functionality.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper in the terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position allows for easy connection to other components, simplifying installation and improving overall system efficiency.

Technical Specifications

Network Interfaces CYP15G0101DXB-BBXI attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1500 Mbps

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.51 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11 mm

Trade Compliance

CYP15G0101DXB-BBXI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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