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CYP15G0403DXB-BGXC

Infineon Technologies

CYP15G0403DXB-BGXC by Infineon Technologies

CYP15G0403DXB-BGXC by Infineon Technologies is a Network Interface with 4 transceivers, operating at 1500 Mbps data rate. It has a supply voltage of 3.3V and consumes a max current of 1.32 mA. This Ethernet transceiver IC is designed for commercial temperature grade applications in grid array package style.

Median Price

$100.540

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

$100.540

100+ parts

$98.540

1k+ parts

$96.530

10k+ parts

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4

$100.540

$98.540

$96.530

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Distributors (In-Stock)

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Vyrian

USA . 8,561 parts In-Stock

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8,561

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Digiode

USA . 570 parts In-Stock

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570

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,716 parts In-Stock

1+ parts

$13.531

100+ parts

$12.990

1k+ parts

$12.449

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3,716

$13.531

$12.990

$12.449

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Ampacity Inc.

Singapore . 492 parts In-Stock

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$242.000

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492

$242.000

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 985 parts In-Stock

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985

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Continental Prestige Electronics

USA . 871 parts In-Stock

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871

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Argo Parts USA

USA . 472 parts In-Stock

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472

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Microchip USA

USA . 427 parts In-Stock

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RC Electronics

USA . 246 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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100

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Kepictronics

USA . 35 parts In-Stock

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Overview

Experience seamless and reliable network connectivity with the CYP15G0403DXB-BGXC by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and performance in all its products. The CYP15G0403DXB-BGXC falls under the category of Network Interfaces, offering users high-speed data transmission at 1500 Mbps. With its advanced technology and commercial-grade temperature tolerance, this Ethernet transceiver is perfect for a wide range of applications. Trust in Infineon Technologies to deliver cutting-edge solutions that bring value, benefits, and advantages to your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Surface Mount: YES

Easy installation on circuit boards without the need for additional components.

Power Supplies (V): 3.3

Efficient power consumption at a standard voltage level for compatibility with various systems.

No. of Terminals: 256

Sufficient number of terminals for versatile connectivity options and data transfer capabilities.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for reliable performance in different environments.

Terminal Finish: TIN SILVER COPPER

Corrosion-resistant finish for enhanced durability and signal transmission quality.

No. of Transceivers: 4

Multiple transceivers for efficient data transmission and network connectivity.

Data Rate: 1500 Mbps

High data transfer rate for fast and seamless network communication.

Moisture Sensitivity Level (MSL): 3

Moisture-resistant design for reliable performance in humid or damp conditions.

Technical Specifications

Network Interfaces CYP15G0403DXB-BGXC attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1500 Mbps

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.745 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

1.32 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Trade Compliance

CYP15G0403DXB-BGXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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