Loading...

CYP15G0101DXB-BBXC

Infineon Technologies

CYP15G0101DXB-BBXC by Infineon Technologies

CYP15G0101DXB-BBXC by Infineon Technologies is a Network Interface with 100 terminals, operating at 3.3V. It features a data rate of 1500 Mbps and uses BICMOS technology. Ideal for interface circuits in telecom applications due to its low profile grid array package style.

Median Price

$175.484

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,286 parts In-Stock

1+ parts

$148.230

100+ parts

$139.340

1k+ parts

$130.440

10k+ parts

-

1,286

$148.230

$139.340

$130.440

-

Verical

USA . 1,404 parts In-Stock

1+ parts

-

100+ parts

$202.738

1k+ parts

$183.325

10k+ parts

-

1,404

-

$202.738

$183.325

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 559 parts In-Stock

1+ parts

$163.913

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$163.913

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$203.940

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$203.940

-

-

-

Vyrian

USA . 176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

176

-

-

-

-

J2 Sourcing AB

Sweden . 19 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19

-

-

-

-

Bristol Electronics

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Eagle Technology Solutions

USA . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Sogenti Electronics

Canada . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 439 parts In-Stock

1+ parts

$9.826

100+ parts

-

1k+ parts

-

10k+ parts

-

439

$9.826

-

-

-

Modulus Dynamics

Lithuania . 3,239 parts In-Stock

1+ parts

$11.777

100+ parts

$11.306

1k+ parts

$10.835

10k+ parts

-

3,239

$11.777

$11.306

$10.835

-

Aztec Data Supply Inc.

USA . 3,572 parts In-Stock

1+ parts

$13.430

100+ parts

-

1k+ parts

-

10k+ parts

-

3,572

$13.430

-

-

-

Semicontronic

India . 1,325 parts In-Stock

1+ parts

$146.660

100+ parts

$142.994

1k+ parts

$142.260

10k+ parts

-

1,325

$146.660

$142.994

$142.260

-

Ampacity Inc.

Singapore . 911 parts In-Stock

1+ parts

$146.660

100+ parts

-

1k+ parts

-

10k+ parts

-

911

$146.660

-

-

-

Corphita

USA . 35 parts In-Stock

1+ parts

$155.286

100+ parts

-

1k+ parts

-

10k+ parts

-

35

$155.286

-

-

-

Continental Prestige Electronics

USA . 526 parts In-Stock

1+ parts

$191.306

100+ parts

-

1k+ parts

-

10k+ parts

$187.480

526

$191.306

-

-

$187.480

Microchip USA

USA . 165 parts In-Stock

1+ parts

$247.848

100+ parts

-

1k+ parts

-

10k+ parts

-

165

$247.848

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,892

-

-

-

-

Lixinc

USA . 10,341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,341

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,773

-

-

-

-

Kepictronics

USA . 5,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,050

-

-

-

-

Metaverse IC Inc.

Canada . 5,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,050

-

-

-

-

Alle Elektronik GmbH

Germany . 4,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,515

-

-

-

-

Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,790

-

-

-

-

Argo Parts USA

USA . 3,559 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,559

-

-

-

-

Bastille Electronics

Australia . 1,926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,926

-

-

-

-

GreenTree Electronics

Israel . 33 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33

-

-

-

-

Overview

Enhance your network interfaces with the CYP15G0101DXB-BBXC by Infineon Technologies. Crafted with precision and quality, this product guarantees top-notch performance and reliability. Perfect for a wide range of applications, this interface circuit offers seamless connectivity and high-speed data transfer at an incredible 1500 Mbps. Experience the value and benefits of cutting-edge technology with this innovative solution. Trust Infineon Technologies to deliver exceptional products that exceed expectations and elevate your networking experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the network interface.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and improving efficiency.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V ensures compatibility with a wide range of devices and systems.

No. of Terminals: 100

Having 100 terminals allows for multiple connections and functions to be supported by the network interface.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this network interface can perform reliably even in demanding conditions.

Data Rate: 1500 Mbps

Supporting a high data rate of 1500 Mbps, this network interface enables fast and efficient data transfer.

Technical Specifications

Network Interfaces CYP15G0101DXB-BBXC attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1500 Mbps

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

100

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.5 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

11 mm

Trade Compliance

CYP15G0101DXB-BBXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 15