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CYP15G0401DXB-BGXC

Infineon Technologies

CYP15G0401DXB-BGXC by Infineon Technologies

CYP15G0401DXB-BGXC by Infineon Technologies is a Network Interface with 4 transceivers, operating at 1500 Mbps data rate. It has a supply voltage of 3.3V and low current consumption of 1.1mA, suitable for Ethernet applications. The package style is grid array with a square shape, making it ideal for surface mount designs in commercial temperature environments.

Median Price

$339.930

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$339.930

100+ parts

$319.530

1k+ parts

$288.940

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2

$339.930

$319.530

$288.940

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Distributors (In-Stock)

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Digiode

USA . 16 parts In-Stock

1+ parts

$322.934

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$322.934

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Vyrian

USA . 146 parts In-Stock

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$339.930

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146

$339.930

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Nova Conductors

Japan . 78 parts In-Stock

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J2 Sourcing AB

Sweden . 4 parts In-Stock

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Semi Source

USA . 4 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Resion

USA . 3 parts In-Stock

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Speed Components Ltd

Israel . 1 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 463 parts In-Stock

1+ parts

$13.215

100+ parts

$12.686

1k+ parts

$12.158

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463

$13.215

$12.686

$12.158

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Ampacity Inc.

Singapore . 2 parts In-Stock

1+ parts

$288.940

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Corphita

USA . 200 parts In-Stock

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$305.937

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Microchip USA

USA . 137 parts In-Stock

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$466.140

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Perfect Parts

USA . 560 parts In-Stock

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560

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Aranea Global

USA . 100 parts In-Stock

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100

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Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

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Overview

Upgrade your network interfaces with the CYP15G0401DXB-BGXC from Infineon Technologies. Known for their high-quality products, Infineon delivers top-notch performance and reliability in every package. This Ethernet transceiver offers a data rate of 1500 Mbps, making it perfect for fast and efficient communication. With a low supply voltage of 3.3V and minimal supply current of just 1.1mA, this component is both energy-efficient and cost-effective. Experience seamless connectivity and superior functionality with the CYP15G0401DXB-BGXC, the ultimate solution for your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is lightweight and durable, making the network interface easy to handle and long-lasting.

Power Supplies (V): 3.3

Operating at a standard power supply of 3.3V ensures compatibility with common power sources.

No. of Terminals: 256

Having a high number of terminals allows for versatile connectivity options and efficient data transfer.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the network interface can function reliably even in warm environments.

Width: 27 mm

Compact width of 27mm allows for easy installation in various devices or systems.

Data Rate: 1500 Mbps

High data rate of 1500 Mbps ensures fast and efficient data transmission, ideal for demanding network applications.

Technical Specifications

Network Interfaces CYP15G0401DXB-BGXC attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1500 Mbps

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.745 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

1.1 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Trade Compliance

CYP15G0401DXB-BGXC Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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