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CYP15G0401DXB-BGXC

Cypress Semiconductor

CYP15G0401DXB-BGXC by Cypress Semiconductor

ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: HBGA; Package Shape: SQUARE;

Median Price

$339.930

Lifecycle Status

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9

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< 1k

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Rochester

USA . 2 parts In-Stock

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$339.930

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$319.530

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$288.940

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2

$339.930

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$288.940

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Digiode

USA . 16 parts In-Stock

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$322.934

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Vyrian

USA . 146 parts In-Stock

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Nova Conductors

Japan . 78 parts In-Stock

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J2 Sourcing AB

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Semi Source

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ACDS - Activité Composants Distribution Service

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Resion

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Speed Components Ltd

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Modulus Dynamics

Lithuania . 463 parts In-Stock

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$13.215

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$12.686

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$12.158

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$288.940

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Corphita

USA . 200 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Perfect Parts

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Aranea Global

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Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

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Technical Specifications

Network Interfaces CYP15G0401DXB-BGXC attributes and parameters. Explore more Network Interfaces devices from Cypress Semiconductor

Specs

Data Rate:

1500 Mbps

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.745 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

1.1 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Trade Compliance

CYP15G0401DXB-BGXC Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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