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CYP15G0401DXB-BGXI

Infineon Technologies

CYP15G0401DXB-BGXI by Infineon Technologies

CYP15G0401DXB-BGXI by Infineon Technologies is a network interface IC with 4 transceivers. It operates at a data rate of 1500 Mbps and has a nominal voltage of 3.3V. This IC is commonly used in Ethernet transceiver applications.

Median Price

$509.830

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$509.830

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$509.830

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Vyrian

USA . 1,056 parts In-Stock

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1,056

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Digiode

USA . 411 parts In-Stock

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411

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 1,069 parts In-Stock

1+ parts

$8.965

100+ parts

$8.606

1k+ parts

$8.248

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-

1,069

$8.965

$8.606

$8.248

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Corohmni

South Africa . 978 parts In-Stock

1+ parts

$13.856

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978

$13.856

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Aztec Data Supply Inc.

USA . 2,358 parts In-Stock

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$16.780

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2,358

$16.780

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AZTECH Wire

Italy . 873 parts In-Stock

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$16.968

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873

$16.968

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Argo Parts USA

USA . 4,027 parts In-Stock

1+ parts

$509.830

100+ parts

$504.732

1k+ parts

$499.633

10k+ parts

$494.535

4,027

$509.830

$504.732

$499.633

$494.535

Continental Prestige Electronics

USA . 3,987 parts In-Stock

1+ parts

$509.830

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$499.633

3,987

$509.830

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$499.633

Ampacity Inc.

Singapore . 353 parts In-Stock

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$631.000

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353

$631.000

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Semicontronic

India . 767 parts In-Stock

1+ parts

$811.000

100+ parts

$790.725

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$786.670

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767

$811.000

$790.725

$786.670

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RC Electronics

USA . 34,456 parts In-Stock

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Lixinc

USA . 17,077 parts In-Stock

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,203 parts In-Stock

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3,203

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Netroflash

USA . 500 parts In-Stock

1+ parts

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$499.633

1k+ parts

$484.338

10k+ parts

$474.142

500

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$499.633

$484.338

$474.142

Microchip USA

USA . 405 parts In-Stock

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405

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Corphita

USA . 65 parts In-Stock

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Overview

Unleash the power of seamless networking with the CYP15G0401DXB-BGXI by Infineon Technologies. As a trusted manufacturer in the industry, Infineon Technologies brings you a high-quality network interface that is designed to deliver exceptional performance and reliability. This product is perfect for a wide range of applications, providing you with the ultimate connectivity solution. With its advanced technology and innovative design, the CYP15G0401DXB-BGXI offers unmatched value, benefits, and advantages to our customers. Say goodbye to connectivity issues and say hello to a world of seamless networking possibilities. Upgrade your network today with the CYP15G0401DXB-BGXI.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product is made of durable and cost-effective plastic/epoxy material, making it a reliable and affordable choice.

Surface Mount:

YES - With the surface mount feature, this product can be easily mounted onto a printed circuit board, ensuring a compact and space-efficient design.

No. of Functions:

1 - This product offers a single function, simplifying its usage and eliminating unnecessary complexities.

Package Shape:

SQUARE - The square package shape allows for easy integration into various electronic setups, promoting versatility and compatibility.

Power Supplies (V):

3.3 - It operates efficiently with a power supply of 3.3 volts, making it compatible with standard power sources.

No. of Terminals:

256 - With 256 terminals, this product offers multiple connection points for enhanced connectivity and optimal performance.

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG - The grid array package style, combined with a heat sink/slug, helps in efficient heat dissipation, preventing overheating issues.

Maximum Operating Temperature:

85 °C - This product can operate under high-temperature conditions up to 85°C, ensuring reliable functionality in demanding environments.

Minimum Operating Temperature:

40 °C - It can withstand extremely low temperatures as low as -40°C, making it suitable for use in harsh weather conditions or industrial environments.

Terminal Finish:

TIN SILVER COPPER - The terminal finish of tin silver copper promotes excellent conductivity and corrosion resistance, ensuring optimal signal transmission and longevity.

Terminal Position:

BOTTOM - The bottom terminal position offers ease of installation and connection, contributing to a hassle-free user experience.

Maximum Seated Height:

1.745 mm - With a maximum seated height of 1.745 mm, this product maintains a compact and low-profile design, ideal for space-constrained applications.

Width:

27 mm - The 27 mm width of this product ensures compatibility with standard board sizes, facilitating seamless integration and installation.

Maximum Time At Peak Reflow Temperature (s):

20 - This product can withstand peak reflow temperatures of up to 260°C for a maximum duration of 20 seconds, allowing for efficient soldering during assembly.

Peak Reflow Temperature °C:

260 - The peak reflow temperature capability of 260°C enables reliable soldering and assembly processes.

Length:

27 mm - Measuring 27 mm in length, this product offers a compact form factor without compromising on performance.

Temperature Grade:

INDUSTRIAL - The industrial-grade temperature rating ensures reliable operation even under harsh environmental conditions, making it suitable for industrial applications.

Technology:

BICMOS - Built using BiCMOS technology, this product combines the advantages of both bipolar and CMOS technologies, resulting in improved efficiency and performance.

Terminal Form:

BALL - The ball terminal form provides a reliable and secure electrical connection, minimizing signal loss and ensuring excellent transmission quality.

No. of Transceivers:

4 - This product contains four transceivers, allowing for multiple simultaneous data transmissions and enhancing data transfer capabilities.

Maximum Supply Current:

1.1 mA - With a maximum supply current of 1.1 mA, this product operates with minimal power consumption, leading to energy efficiency.

Telecom IC Type:

ETHERNET TRANSCEIVER - As an Ethernet transceiver, this product enables high-speed data communication over networks, making it suitable for telecom applications.

Nominal Supply Voltage:

3.3 V - The nominal supply voltage of 3.3 V ensures compatibility with standard voltage levels, simplifying integration and usage.

Terminal Pitch:

1.27 mm - The terminal pitch of 1.27 mm allows for accurate and reliable connections, promoting stable data transmission and reducing signal interference.

Data Rate:

1500 Mbps - With a high data rate of 1500 Mbps, this product enables fast and efficient data transfer, improving overall network performance.

Moisture Sensitivity Level (MSL):

3 - The moisture sensitivity level of 3 ensures that the product is resistant to moisture-related damages, enhancing its durability and longevity.

Technical Specifications

Network Interfaces CYP15G0401DXB-BGXI attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

1500 Mbps

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

27 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.745 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

1.1 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

27 mm

Trade Compliance

CYP15G0401DXB-BGXI Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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