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NCV7382DR2

Onsemi

NCV7382DR2 by Onsemi

NCV7382DR2 by Onsemi is a Line Transceiver IC with 8 terminals, operating at -40 to 125 °C. It features Schmitt Trigger input characteristics, with a max supply voltage of 5.5 V and transmit delay of 5000 ns. Ideal for automotive applications due to its small outline package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,326 parts In-Stock

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Digiode

USA . 940 parts In-Stock

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940

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Modulus Dynamics

Lithuania . 10 parts In-Stock

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$8.363

100+ parts

$8.363

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$8.363

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10

$8.363

$8.363

$8.363

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AZTECH Wire

Italy . 1,204 parts In-Stock

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$14.400

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TANS Electronics

Latvia . 7,602 parts In-Stock

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Kulean Microsystems

USA . 7,329 parts In-Stock

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Microchip USA

USA . 5,054 parts In-Stock

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Problanco Electronics

Mexico . 3,686 parts In-Stock

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SupplyDigital Components

Austria . 1,122 parts In-Stock

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Vigor

Singapore . 348 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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Corphita

USA . 133 parts In-Stock

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Corohmni

South Africa . 66 parts In-Stock

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Overview

Upgrade your communication systems with the NCV7382DR2 by Onsemi, a top-of-the-line line driver & receiver that guarantees quality and reliability. Designed for automotive applications, this product offers seamless connectivity and efficient signal transmission, ensuring smooth operation in any environment. With Onsemi's reputation for excellence in manufacturing, you can trust that this device delivers unparalleled performance and durability. Say goodbye to communication hiccups and hello to seamless connectivity with the NCV7382DR2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product reliable and long-lasting.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Suitable for applications that require a low maximum supply voltage, making it versatile for a variety of projects.

Package Shape: RECTANGULAR

The rectangular shape allows for a compact design, saving space on the circuit board for other components.

Maximum Transmit Delay: 5000 ns

Provides fast and efficient data transmission, ensuring smooth operation of the product.

Maximum Supply Voltage-1: 18 V

Offers a high maximum supply voltage option for applications that require more power.

No. of Terminals: 8

Provides sufficient connections for various inputs and outputs, allowing for flexibility in system design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Minimum Supply Voltage-1: 7 V

Can operate at a relatively low minimum supply voltage, making it energy-efficient and cost-effective.

Minimum Supply Voltage: 4.5 V

Suitable for applications that require a low minimum supply voltage, offering versatility in power requirements.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, suitable for a wide range of environments.

Terminal Finish: Tin/Lead (Sn80Pb20)

The tin/lead terminal finish provides excellent solderability, ensuring easy and reliable connections.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit board layout, accommodating various design requirements.

Maximum Seated Height: 1.75 mm

The low seated height saves space on the circuit board, ideal for thin and compact electronic devices.

Width: 3.9 mm

The narrow width allows for a compact design, suitable for space-constrained applications.

Peak Reflow Temperature °C: 235

Capable of withstanding high reflow temperatures during assembly, ensuring reliable solder joints.

Length: 4.9 mm

The compact length saves space on the circuit board, ideal for small electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to withstand automotive temperature requirements, making it suitable for automotive applications.

Maximum Receive Delay: 6000 ns

Provides fast data reception, ensuring smooth operation and efficient communication.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and inspection during assembly, ensuring reliable connections.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input characteristics provide noise immunity and signal conditioning, ensuring reliable operation.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage, compatible with most electronic systems and components.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for close spacing of terminals, ideal for compact designs.

Nominal Supply Voltage-1: 12 V

Provides a higher nominal supply voltage option for applications that require more power.

Interface IC Type: LINE TRANSCEIVER

The line transceiver interface IC type allows for reliable data transmission and reception, ensuring smooth communication.

Technical Specifications

Line Drivers & Receivers NCV7382DR2 attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Receive Delay:

6000 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

18 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

5000 ns

Width:

3.9 mm

Trade Compliance

NCV7382DR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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