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NCV7356D2R2

Onsemi

NCV7356D2R2 by Onsemi

NCV7356D2R2 by Onsemi is an AEC-Q100 compliant network interface IC with 14 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. With a data rate of 0.1 Mbps and nominal voltage of 16V, it is ideal for interface circuit in automotive telecom systems.

Median Price

$0.647

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 32 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

$0.537

10k+ parts

$0.479

32

-

$0.647

$0.537

$0.479

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,334 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

-

2,334

$0.504

-

-

-

Chip Stock

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

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63,000

-

-

-

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Vyrian

USA . 8,640 parts In-Stock

1+ parts

-

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8,640

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 165 parts In-Stock

1+ parts

$0.478

100+ parts

-

1k+ parts

-

10k+ parts

-

165

$0.478

-

-

-

Vigor

Singapore . 805 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

-

805

$0.510

-

-

-

Corohmni

South Africa . 106 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

-

106

$0.531

-

-

-

AZTECH Wire

Italy . 1,212 parts In-Stock

1+ parts

$17.250

100+ parts

-

1k+ parts

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10k+ parts

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1,212

$17.250

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 23,550 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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23,550

-

-

-

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Microchip USA

USA . 7,628 parts In-Stock

1+ parts

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100+ parts

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7,628

-

-

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Kulean Microsystems

USA . 6,075 parts In-Stock

1+ parts

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100+ parts

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6,075

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-

-

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TANS Electronics

Latvia . 5,452 parts In-Stock

1+ parts

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5,452

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SupplyDigital Components

Austria . 4,015 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,015

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Problanco Electronics

Mexico . 2,334 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,334

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Kepictronics

USA . 1,595 parts In-Stock

1+ parts

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100+ parts

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1,595

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Metaverse IC Inc.

Canada . 1,595 parts In-Stock

1+ parts

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1,595

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UHIMA Technologies

Türkiye . 8 parts In-Stock

1+ parts

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8

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Overview

Experience unparalleled quality and reliability with the NCV7356D2R2 by Onsemi. As a leading manufacturer in the industry, Onsemi provides cutting-edge solutions for network interfaces like this one. This product offers exceptional value to customers through its wide range of applications and high performance capabilities. Whether you're in automotive, telecommunications, or another industry, the NCV7356D2R2 delivers unmatched benefits and advantages that will take your projects to the next level. Trust Onsemi for all your interface circuit needs and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards.

Screening Level: AEC-Q100

AEC-Q100 compliance ensures high reliability and quality standards for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape provides compact design and easy integration into various systems.

Power Supplies (V): 5/27

Supports a wide range of power supply voltages, increasing flexibility for different applications.

No. of Terminals: 14

Sufficient number of terminals for connectivity and integration with other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and allows for efficient use of board real estate.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables operation in cold environments without issues.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity.

Maximum Seated Height: 1.75 mm

Low seated height allows for slim and space-saving design in applications.

Width: 3.9 mm

Narrow width facilitates compact and efficient PCB layout.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes thermal stress on components during assembly.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures proper solder melting and joint reliability.

Length: 8.65 mm

Optimal length for easy integration and placement on circuit boards.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures operation in extreme temperature conditions commonly found in vehicles.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and reliability during handling and assembly.

Telecom IC Type: INTERFACE CIRCUIT

Specialized telecom IC type designed for efficient data transmission and communication protocols.

Nominal Supply Voltage: 16 V

Nominal supply voltage compatibility of 16V suitable for a wide range of applications and systems.

Terminal Pitch: 1.27 mm

Close terminal pitch for high-density and compact PCB design.

Data Rate: 0.1 Mbps

Supports data rates of 0.1 Mbps for efficient data transmission in various network applications.

Technical Specifications

Network Interfaces NCV7356D2R2 attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/27

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

16 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NCV7356D2R2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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