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TJA1050T/VM

NXP Semiconductors

TJA1050T/VM by NXP Semiconductors

NXP Semiconductors' TJA1050T/VM is an 8-terminal network interface IC with a small outline package. Operating b/w -40 to 125°C, it's ideal for automotive applications. Featuring nickel palladium gold silver terminals, it has a nominal voltage of 5V and terminal pitch of 1.27mm.

Median Price

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Lifecycle Status

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Flip Electronics

USA . 90,000 parts In-Stock

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ComSIT Distribution GmbH

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Digiode

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Infinite Electronics LLP

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Cyclops Electronics Ltd

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Vyrian

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J2 Sourcing AB

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Nova Conductors

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EMSNET

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North Shore Components

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Advanced Electronics

New Zealand . 550 parts In-Stock

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$8.171

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$7.762

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Aztec Data Supply Inc.

USA . 667 parts In-Stock

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Corohmni

South Africa . 53 parts In-Stock

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AZTECH Wire

Italy . 713 parts In-Stock

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Semicontronic

India . 376 parts In-Stock

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Ampacity Inc.

Singapore . 786 parts In-Stock

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Overview

Unleash the power of seamless network connectivity with the TJA1050T/VM by NXP Semiconductors. Crafted with precision and expertise, this Network Interface device offers unparalleled reliability and performance in automotive applications. Experience seamless communication and enhanced functionality with this cutting-edge solution. Unlock a world of possibilities and elevate your projects with the exceptional quality and value that only NXP Semiconductors can provide. Choose the TJA1050T/VM for unmatched benefits and advantages that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for networking applications.

Surface Mount: YES

Surface mount design allows for easy installation on printed circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for compatibility with various devices and systems.

No. of Terminals: 8

Having 8 terminals allows for multiple connections within the network interface, providing flexibility in connectivity options.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in demanding environments.

Width: 3.9 mm

The compact width of 3.9mm helps in saving space when integrating the network interface into compact devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this network interface can withstand harsh conditions typically found in vehicles.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this network interface is compatible with standard power sources, making it easy to integrate into existing systems.

Technical Specifications

Network Interfaces TJA1050T/VM attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TJA1050T/VM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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