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NCV70627DQ001G

Onsemi

NCV70627DQ001G by Onsemi

NCV70627DQ001G by Onsemi is a Motion Control IC with 36 terminals, operating at supply voltages from 5.5V to 29V. It features a max output current of 0.8A and is designed for stepper motor control applications. The package style is small outline with a heat sink, suitable for surface mount assembly in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,008 parts In-Stock

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Digiode

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Vigor

Singapore . 173 parts In-Stock

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$4.820

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AZTECH Wire

Italy . 525 parts In-Stock

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Problanco Electronics

Mexico . 7,319 parts In-Stock

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SupplyDigital Components

Austria . 4,918 parts In-Stock

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TANS Electronics

Latvia . 1,607 parts In-Stock

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Microchip USA

USA . 1,054 parts In-Stock

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UHIMA Technologies

Türkiye . 606 parts In-Stock

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Kulean Microsystems

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Corohmni

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Overview

Enhance your motion control applications with the NCV70627DQ001G by Onsemi. Crafted with precision and expertise, this small outline stepper motor controller offers unparalleled quality and performance. With a wide supply voltage range of 5.5V to 29V, dual terminal position, and exceptional output current of 0.8A, this IC provides optimal functionality for your projects. Trust in Onsemi's reputation for reliability and innovation as you experience the value and benefits of seamless motion control with the NCV70627DQ001G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, making it a suitable choice for applications where weight and cost are important factors.

Surface Mount: YES

Being surface mountable allows for easy integration into PCBs, saving space and making assembly processes more efficient.

Nominal Supply Voltage (Vsup): 7 V

Operating within the nominal supply voltage range ensures stable performance and compatibility with standard power sources.

Power Supplies (V): 5.5/29

Wide range of power supplies supported allows for flexibility in different application scenarios, accommodating various voltage inputs.

No. of Terminals: 36

Having a large number of terminals enables connectivity with multiple components and peripherals, expanding the capabilities of the product.

Maximum Output Current: 0.8 A

Capable of delivering a relatively high output current, making it suitable for driving stepper motors and other high-current applications.

Maximum Supply Voltage (Vsup): 29 V

Support for high supply voltages allows for more powerful operation and compatibility with a wider range of power sources.

Technical Specifications

Motion Control ICs NCV70627DQ001G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

36

Maximum Output Current:

.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5.5/29

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

5.5 V

Nominal Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

NCV70627DQ001G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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