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TLE94106ELXUMA1

Infineon Technologies

TLE94106ELXUMA1 by Infineon Technologies

TLE94106ELXUMA1 by Infineon Technologies is a motion control IC with 1 function. It operates at a nominal voltage of 5V and has a max output current of 2A. This IC is commonly used as a brush DC motor controller in industrial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,603 parts In-Stock

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Digiode

USA . 997 parts In-Stock

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997

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Ampacity Inc.

Singapore . 761 parts In-Stock

1+ parts

$4.500

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761

$4.500

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Semicontronic

India . 585 parts In-Stock

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$7.500

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$7.312

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$7.275

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585

$7.500

$7.312

$7.275

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Corohmni

South Africa . 12 parts In-Stock

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$11.470

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12

$11.470

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AZTECH Wire

Italy . 219 parts In-Stock

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$18.145

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$18.145

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Modulus Dynamics

Lithuania . 931 parts In-Stock

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$20.723

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$19.894

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$19.065

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931

$20.723

$19.894

$19.065

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Aztec Data Supply Inc.

USA . 46,482 parts In-Stock

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$23.060

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Microchip USA

USA . 5,651 parts In-Stock

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Argo Parts USA

USA . 3,644 parts In-Stock

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Continental Prestige Electronics

USA . 3,474 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 211 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Discover the power of precise motion control with the TLE94106ELXUMA1 by Infineon Technologies. As a trusted manufacturer in the industry, Infineon delivers unparalleled quality and reliability. The TLE94106ELXUMA1, part of the Motion Control IC category, offers countless applications for a wide range of industries. With its compact size and advanced features, this product provides exceptional value and benefits to our customers. Experience seamless performance, enhanced efficiency, and unparalleled control with the TLE94106ELXUMA1. Upgrade your motion control capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this Motion Control IC durable and resistant to external factors such as moisture and temperature variations.

Surface Mount: YES

With the surface mount feature, this Motion Control IC can be easily mounted onto a circuit board, saving space and providing convenience during the assembly process.

No. of Functions: 1

This Motion Control IC integrates multiple functions into a single component, reducing the need for additional components and simplifying the overall design, making it a cost-effective choice.

Package Shape: RECTANGULAR

The rectangular package shape of this Motion Control IC ensures easy handling and alignment during the manufacturing and assembling process, facilitating efficient production.

Nominal Supply Voltage (Vsup): 5 V

The nominal supply voltage of 5 V provides a stable power source for this Motion Control IC, ensuring consistent and reliable performance in various motion control applications.

No. of Terminals: 24

With 24 terminals, this Motion Control IC allows for easy and flexible integration into different circuit designs, providing versatility and compatibility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

The small outline, heat sink/slug, low profile, and shrink pitch package style of this Motion Control IC enhances thermal dissipation, increases power handling capabilities, and reduces overall dimensions, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The wide maximum operating temperature range of 85°C enables this Motion Control IC to operate reliably in harsh environmental conditions, ensuring optimal performance even under high temperature conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this Motion Control IC can withstand extremely low temperatures, making it suitable for applications in cold environments or industrial settings.

Terminal Position: DUAL

The dual terminal position of this Motion Control IC allows for easy and flexible connection options, facilitating integration into various circuit layouts and optimizing design possibilities.

Maximum Seated Height: 1.7 mm

The low maximum seated height of 1.7 mm ensures a compact profile for this Motion Control IC, allowing for efficient use of space and enabling integration in size-limited designs.

Width (mm): 3.9 mm

With a width of 3.9 mm, this Motion Control IC offers a compact form factor, contributing to space-saving designs and enabling integration in slim devices or systems.

Other IC type: BRUSH DC MOTOR CONTROLLER

This Motion Control IC specifically functions as a brush DC motor controller, providing precise and efficient control over motor speed and direction, making it an ideal choice for motion control applications involving DC motors.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage requirement of 3 V allows this Motion Control IC to operate with a wide range of power sources, providing flexibility and compatibility with various power systems.

Length: 8.65 mm

This Motion Control IC has a length of 8.65 mm, which, combined with its compact width and low profile, contributes to its small size and makes it suitable for applications with limited space.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures that this Motion Control IC can operate reliably in harsh industrial environments and withstand temperature fluctuations commonly encountered in industrial settings.

Maximum Output Current: 2 A

With a maximum output current of 2 A, this Motion Control IC can provide sufficient power to drive motors and other load devices, enabling effective motion control in a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form allows for secure and reliable solder connections, ensuring stable electrical connections between this Motion Control IC and the circuit board, reducing the risk of faulty connections.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm provides compatibility with standard PCB manufacturing processes and equipment, facilitating easy integration of this Motion Control IC into circuit designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V allows for a wide input voltage range, accommodating different power supply configurations and improving the compatibility of this Motion Control IC.

Technical Specifications

Motion Control ICs TLE94106ELXUMA1 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TLE94106ELXUMA1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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