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NCV7703BD2R2G

Onsemi

NCV7703BD2R2G by Onsemi

NCV7703BD2R2G by Onsemi is a Motion Control IC with 14 terminals and a supply voltage range of 3.3V to 40V. It features a small outline package, Gull Wing terminal form, and is designed for brush DC motor control applications. With surface mount capability and compact dimensions (8.65mm x 3.9mm), it offers precise control for various motion control systems.

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6

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1k+

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Bristol Electronics

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Vigor

Singapore . 651 parts In-Stock

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$1.410

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Ampacity Inc.

Singapore . 469 parts In-Stock

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Aztec Data Supply Inc.

USA . 17,889 parts In-Stock

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Semicontronic

India . 1,066 parts In-Stock

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$5.335

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AZTECH Wire

Italy . 209 parts In-Stock

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Advanced Electronics

New Zealand . 47 parts In-Stock

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Kulean Microsystems

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Overview

Elevate your motion control systems with the NCV7703BD2R2G by Onsemi, a top-tier manufacturer known for its quality products. This small outline IC offers unparalleled performance and reliability, making it perfect for a wide range of applications. From robotics to automotive systems, this brush DC motor controller ensures smooth operation and precise control. Experience seamless integration, exceptional value, and unmatched benefits with the NCV7703BD2R2G - the ultimate choice for customers who demand nothing but the best.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and can withstand a wide range of operating conditions, making this product reliable for long-term use.

Surface Mount: YES

Surface mount packaging allows for easy and efficient integration into electronic circuits, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, making it versatile and widely applicable.

No. of Terminals: 14

Having 14 terminals provides flexibility in connection options and enables the IC to control multiple functions, enhancing its functionality.

Maximum Supply Current (Isup): 4 mA

With a low maximum supply current, this IC is energy-efficient and suitable for applications where power consumption is a concern.

Technical Specifications

Motion Control ICs NCV7703BD2R2G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES WITH THE RANGE OF 5.5V TO 40V SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5,5.5/40

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

NCV7703BD2R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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