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NCV70522DQ004G

Onsemi

NCV70522DQ004G by Onsemi

NCV70522DQ004G by Onsemi is a Motion Control IC with 36 terminals, operating at -40 to 125 °C. It features a Nominal Voltage of 12V, suitable for automotive applications. This Stepper Motor Controller has a compact rectangular package and supports surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 76,500 parts In-Stock

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Flip Electronics

USA . 63,000 parts In-Stock

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Vyrian

USA . 5,122 parts In-Stock

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Digiode

USA . 337 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$11.756

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$10.698

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$9.640

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$11.756

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$9.640

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AZTECH Wire

Italy . 174 parts In-Stock

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$14.580

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Kulean Microsystems

USA . 5,387 parts In-Stock

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Problanco Electronics

Mexico . 3,478 parts In-Stock

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Microchip USA

USA . 2,912 parts In-Stock

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SupplyDigital Components

Austria . 1,422 parts In-Stock

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Vigor

Singapore . 752 parts In-Stock

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Corphita

USA . 457 parts In-Stock

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Corohmni

South Africa . 356 parts In-Stock

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UHIMA Technologies

Türkiye . 237 parts In-Stock

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TANS Electronics

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Overview

Enhance your motion control applications with the NCV70522DQ004G by Onsemi. Crafted with precision and quality in mind, this stepper motor controller offers reliable performance and seamless integration for a variety of automotive applications. With a compact design and high-grade materials, this product ensures optimal functionality while providing exceptional value and efficiency. Let Onsemi elevate your projects with cutting-edge technology and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IC lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto PCBs, saving space and reducing costs.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh operating conditions without compromising performance.

Terminal Finish: NICKEL GOLD PALLADIUM

The nickel gold palladium terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width (mm): 7.5 mm

The compact width of 7.5mm allows for space-saving design and installation in tight spaces.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets stringent temperature requirements and standards for reliable performance in automotive environments.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this IC is suitable for use in a variety of environments without risk of moisture damage.

Technical Specifications

Motion Control ICs NCV70522DQ004G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G36

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

5,6/30

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

12 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

7.5 mm

Trade Compliance

NCV70522DQ004G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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