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NCV70514MW007R2G

Onsemi

NCV70514MW007R2G by Onsemi

NCV70514MW007R2G by Onsemi is a Motion Control IC with 32 terminals, operating voltage range of 6-29V, and temperature range of -45 to 145 °C. It is a Stepper Motor Controller suitable for automotive applications due to its compact square package design and surface mount capability.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Flip Electronics

USA . 570,000 parts In-Stock

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Chip Stock

USA . 28,000 parts In-Stock

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Vyrian

USA . 4,370 parts In-Stock

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Digiode

USA . 1,932 parts In-Stock

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Vigor

Singapore . 201 parts In-Stock

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$1.820

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201

$1.820

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AZTECH Wire

Italy . 919 parts In-Stock

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$8.720

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919

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QUARKTWIN TECHNOLOGY LTD

USA . 24,172 parts In-Stock

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Problanco Electronics

Mexico . 4,621 parts In-Stock

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Microchip USA

USA . 4,303 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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TANS Electronics

Latvia . 2,695 parts In-Stock

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SupplyDigital Components

Austria . 961 parts In-Stock

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Corphita

USA . 454 parts In-Stock

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UHIMA Technologies

Türkiye . 418 parts In-Stock

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Kulean Microsystems

USA . 194 parts In-Stock

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Corohmni

South Africa . 144 parts In-Stock

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Overview

Enhance your motion control applications with the NCV70514MW007R2G by Onsemi. Crafted with precision and reliability, this advanced stepper motor controller offers unparalleled performance and efficiency. Dive into a world of seamless operation and precise control, thanks to the innovative design and cutting-edge technology from Onsemi. Elevate your projects with this top-of-the-line motion control IC, designed to exceed expectations and deliver exceptional results. Experience the difference with Onsemi's NCV70514MW007R2G - the perfect solution for all your motion control needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 14 V

Suitable voltage range for powering the Motion Control ICs, ensuring optimal performance.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package design with heat sink and slim profile ensures effective heat dissipation and space-saving in compact applications.

Maximum Operating Temperature: 145 °C

Wide temperature range allows for reliable operation in harsh environments without compromising performance.

Minimum Operating Temperature: -45 °C

Capable of functioning in cold temperatures, making it suitable for a variety of industrial and automotive applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and reliable electrical connections, ensuring long-term performance.

Width (mm): 5 mm

Compact width allows for easy integration into tight spaces and miniaturized designs.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage allows for flexibility in power input options, catering to different system requirements.

Temperature Grade: AUTOMOTIVE

Automotive-grade designation ensures reliable and durable performance in automotive applications, meeting industry standards.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with RoHS regulations, making it a sustainable choice.

Maximum Supply Voltage (Vsup): 29 V

High maximum supply voltage allows for versatility in power input options, accommodating a wide range of operating conditions.

Technical Specifications

Motion Control ICs NCV70514MW007R2G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

145 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NCV70514MW007R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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