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NCV70521MN003R2G

Onsemi

NCV70521MN003R2G by Onsemi

NCV70521MN003R2G by Onsemi is a Motion Control IC with 32 terminals, operating voltage of 6-30V, and output current of 1.6A. It is ideal for automotive applications due to its low profile design, high temperature range up to 125 °C, and surface mount package style.

Median Price

$2.670

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$2.670

1k+ parts

$2.390

10k+ parts

$2.250

10

-

$2.670

$2.390

$2.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 228 parts In-Stock

1+ parts

$2.822

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$2.822

-

-

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Vyrian

USA . 4,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,204

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,464 parts In-Stock

1+ parts

$2.673

100+ parts

-

1k+ parts

-

10k+ parts

-

1,464

$2.673

-

-

-

Vigor

Singapore . 471 parts In-Stock

1+ parts

$2.850

100+ parts

-

1k+ parts

-

10k+ parts

-

471

$2.850

-

-

-

Corohmni

South Africa . 430 parts In-Stock

1+ parts

$2.970

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$2.970

-

-

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AZTECH Wire

Italy . 672 parts In-Stock

1+ parts

$18.830

100+ parts

-

1k+ parts

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10k+ parts

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672

$18.830

-

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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15,000

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 13,659 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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13,659

-

-

-

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Kulean Microsystems

USA . 6,923 parts In-Stock

1+ parts

-

100+ parts

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6,923

-

-

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TANS Electronics

Latvia . 6,904 parts In-Stock

1+ parts

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100+ parts

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6,904

-

-

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SupplyDigital Components

Austria . 593 parts In-Stock

1+ parts

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593

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Problanco Electronics

Mexico . 411 parts In-Stock

1+ parts

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411

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Microchip USA

USA . 346 parts In-Stock

1+ parts

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100+ parts

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346

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UHIMA Technologies

Türkiye . 77 parts In-Stock

1+ parts

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77

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Overview

Unleash the power of precise motion control with Onsemi's NCV70521MN003R2G! Crafted with cutting-edge technology and precision engineering, this motion control IC is designed to elevate your applications to new heights. Whether you're looking to enhance automotive systems, industrial automation, or robotics, this product offers unparalleled reliability, efficiency, and performance. Say goodbye to limitations and hello to endless possibilities with Onsemi's NCV70521MN003R2G. Elevate your projects today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs in production.

Package Shape: SQUARE

Square package shape provides a compact footprint, saving space on the PCB and allowing for more components to be integrated into a smaller area.

Nominal Supply Voltage (Vsup): 12 V

Operates at a common and stable supply voltage, ensuring compatibility with a wide range of power sources.

Power Supplies (V): 5,6/30

Supports multiple power supply options, giving flexibility in system design and allowing for optimal power management.

No. of Terminals: 32

With a high number of terminals, this IC can accommodate complex control configurations and facilitate versatile connectivity.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Diverse package styles offer thermal management solutions, compact design, and compatibility with different mounting methods for enhanced performance.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable operation even in demanding environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in extreme cold conditions, making this IC suitable for automotive and industrial applications.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections over time.

Terminal Position: QUAD

Quad terminal position simplifies installation and maintenance, offering ease of soldering and connection for efficient integration.

Maximum Seated Height: 0.9 mm

Low seated height enables a slim profile and compact design, making this IC suitable for space-constrained applications.

Width (mm): 7 mm

Compact width allows for efficient use of board space while accommodating other components, improving overall system integration.

Other IC type: STEPPER MOTOR CONTROLLER

Specialized for stepper motor control, offering precise and efficient motion control capabilities for applications requiring accurate positioning.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage provides flexibility for powering the IC in various voltage scenarios, ensuring compatibility with different systems.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for proper soldering and bonding during manufacturing processes, ensuring reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables secure and effective soldering, contributing to the overall durability and performance of the IC.

Length: 7 mm

Compact length contributes to the overall small form factor of the IC, making it suitable for applications where space is at a premium.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliable performance in automotive applications subjected to harsh conditions.

Maximum Supply Current (Isup): 10 mA

Low maximum supply current consumption helps in minimizing power usage and heat generation, contributing to energy efficiency and system reliability.

Maximum Output Current: 1.6 A

High maximum output current capability allows for driving demanding loads with high precision, making it suitable for various motion control applications.

Terminal Form: NO LEAD

No lead terminal form simplifies assembly and enhances reliability by eliminating the risk of solder joint failure associated with traditional leaded components.

Terminal Pitch: 0.65 mm

Narrow terminal pitch enables high-density mounting and allows for compact design, optimizing board space usage and promoting efficient system integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the IC's resistance to moisture-related damage during storage and assembly processes, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 30 V

Supports a wide range of supply voltages, enhancing compatibility with various systems and allowing for flexible power configurations.

Technical Specifications

Motion Control ICs NCV70521MN003R2G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,6/30

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

30 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

NCV70521MN003R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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