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NCP435FCT2G

Onsemi

NCP435FCT2G by Onsemi

NCP435FCT2G by Onsemi is a MOSFET gate driver with a max supply voltage of 3.6V and high side driver feature. It has a turn-on time of 190us, making it suitable for industrial applications requiring precise control over power supplies. With a compact square package style and surface mount capability, it offers efficient performance in various electronic systems.

Median Price

$0.246

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 66,000 parts In-Stock

1+ parts

$0.126

100+ parts

-

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66,000

$0.126

-

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DigiKey

USA . 331,944 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.130

331,944

-

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$0.130

Flip Electronics (Authorized)

USA . 319,944 parts In-Stock

1+ parts

-

100+ parts

-

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319,944

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Rochester

USA . 63,325 parts In-Stock

1+ parts

-

100+ parts

$0.255

1k+ parts

$0.211

10k+ parts

$0.189

63,325

-

$0.255

$0.211

$0.189

Verical

USA . 33,325 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$0.236

33,325

-

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$0.236

Master Electronics

USA . 2,625 parts In-Stock

1+ parts

-

100+ parts

$0.337

1k+ parts

$0.303

10k+ parts

$0.281

2,625

-

$0.337

$0.303

$0.281

Chip1Stop

Japan . 2,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.351

10k+ parts

$0.336

2,625

-

-

$0.351

$0.336

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,210 parts In-Stock

1+ parts

$0.120

100+ parts

-

1k+ parts

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1,210

$0.120

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Vyrian

USA . 1,609 parts In-Stock

1+ parts

$0.126

100+ parts

-

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10k+ parts

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1,609

$0.126

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Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.750

100+ parts

$0.375

1k+ parts

$0.150

10k+ parts

$0.113

3,000

$0.750

$0.375

$0.150

$0.113

Flip Electronics

USA . 331,944 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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331,944

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Chip Stock

USA . 38,000 parts In-Stock

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38,000

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ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

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3,000

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Dan-Mar Components

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Rapid Electronics

USA . 2,625 parts In-Stock

1+ parts

-

100+ parts

$0.270

1k+ parts

-

10k+ parts

-

2,625

-

$0.270

-

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IBS Electronics

USA . 2,625 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.330

10k+ parts

$0.317

2,625

-

-

$0.330

$0.317

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,479 parts In-Stock

1+ parts

$0.113

100+ parts

-

1k+ parts

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10k+ parts

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1,479

$0.113

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Continental Prestige Electronics

USA . 30,000 parts In-Stock

1+ parts

$0.126

100+ parts

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30,000

$0.126

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Corohmni

South Africa . 131 parts In-Stock

1+ parts

$0.126

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131

$0.126

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Component Stockers USA

USA . 63,605 parts In-Stock

1+ parts

$0.210

100+ parts

$0.200

1k+ parts

$0.180

10k+ parts

$0.180

63,605

$0.210

$0.200

$0.180

$0.180

Vigor

Singapore . 208 parts In-Stock

1+ parts

$0.600

100+ parts

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208

$0.600

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GreenTree Electronics

Israel . 22,000 parts In-Stock

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Perfect Parts

USA . 8,221 parts In-Stock

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SupplyDigital Components

Austria . 8,021 parts In-Stock

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Kulean Microsystems

USA . 6,770 parts In-Stock

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6,770

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Problanco Electronics

Mexico . 4,406 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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TANS Electronics

Latvia . 2,806 parts In-Stock

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Authorized Procurement Solutions

USA . 1,190 parts In-Stock

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1,190

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Assy Fe

Spain . 1,147 parts In-Stock

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UHIMA Technologies

Türkiye . 367 parts In-Stock

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367

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Microchip USA

USA . 272 parts In-Stock

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272

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Overview

Unleash the power of your electronics with the NCP435FCT2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality MOSFET Gate Drivers that are designed to optimize performance and reliability. Whether you're working on automotive applications, industrial controls, or power management systems, this product offers unparalleled value, benefits, and advantages. Trust Onsemi to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the gate driver.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards.

Maximum Supply Voltage: 3.6 V

Suitable for a wide range of applications requiring different supply voltage levels.

Package Shape: SQUARE

Compact design for efficient use of space on the circuit board.

Power Supplies (V): 1/3.6

Supports both 1V and 3.6V power supplies, providing flexibility in design.

No. of Terminals: 4

Simplified connection setup for easy integration into circuits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables high density packaging and efficient heat dissipation.

Minimum Supply Voltage: 1 V

Can operate efficiently at low supply voltage levels.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Simplified PCB layout and wiring setup for easy installation.

Maximum Seated Height: 0.63 mm

Low profile design for space-constrained applications.

Width: 0.96 mm

Compact size for efficient use of board space.

High Side Driver: YES

Allows for driving high side switches efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures reliability during the reflow soldering process.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for manufacturing processes.

Length: 0.96 mm

Compact size for efficient use of board space.

Temperature Grade: INDUSTRIAL

Designed to operate in harsh industrial environments.

Maximum Output Current: 2 A

Capable of driving high current loads for a variety of applications.

Terminal Form: BALL

Allows for efficient soldering and reliable connections.

Nominal Supply Voltage: 3.3 V

Optimal supply voltage for stable operation.

Turn-on Time: 190 us

Fast turn-on time for quick response in switching applications.

Terminal Pitch: 0.5 mm

Compact pitch for efficient use of board space.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Versatile interface options for compatibility with different systems.

Technical Specifications

MOSFET Gate Drivers NCP435FCT2G attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

Driver No. of Bits:

1

High Side Driver:

YES

JESD-30 Code:

S-PBGA-B4

JESD-609 Code:

e1

Length:

.96 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1/3.6

Qualification:

Not Qualified

Maximum Seated Height:

.63 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Turn-on Time:

190 us

Width:

.96 mm

Trade Compliance

NCP435FCT2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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