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IR2110PBF

Infineon Technologies

IR2110PBF by Infineon Technologies

IR2110PBF by Infineon Technologies is a MOSFET gate driver with a max supply voltage of 20V and high side driver feature. It operates in automotive-grade temperatures from -40 to 125°C, making it suitable for various applications requiring precise turn-on/off times of 0.15us and 0.125us. With a nominal output peak current limit of 2.5A, this CMOS technology-based driver is ideal for half-bridge based MOSFET driving in automotive electronics.

Median Price

$3.259

Lifecycle Status

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44

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1k+

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Chip1Stop

Japan . 13,759 parts In-Stock

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Arrow

USA . 5,262 parts In-Stock

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$2.015

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$1.778

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$1.726

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$2.015

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$1.726

Verical

USA . 13,759 parts In-Stock

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$3.259

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$1.939

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$1.881

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$1.649

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Element14

Singapore . 1,476 parts In-Stock

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Newark

USA . 4,722 parts In-Stock

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Mouser Electronics

USA . 1,627 parts In-Stock

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DigiKey

USA . 2,983 parts In-Stock

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Future Electronics

Canada . 2,022 parts In-Stock

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UK . 1,074 parts In-Stock

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Nova Conductors

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Poland . 4,377 parts In-Stock

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TME

Poland . 672 parts In-Stock

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NAC Semi

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Micros sp.j. W. Kędra i J. Lic

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Micros

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Corel Iberica Componentes, S.L.

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Ampacity Inc.

Singapore . 5,363 parts In-Stock

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Semicontronic

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Component Stockers USA

USA . 31,781 parts In-Stock

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$1.680

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Argo Parts USA

USA . 4,089 parts In-Stock

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$1.955

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Modulus Dynamics

Lithuania . 402 parts In-Stock

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Corohmni

South Africa . 208 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Corphita

USA . 955 parts In-Stock

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Benley Electronics

USA . 1 parts In-Stock

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Continental Prestige Electronics

USA . 2,153 parts In-Stock

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$3.540

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$2.210

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$1.760

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Aztec Data Supply Inc.

USA . 2,691 parts In-Stock

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$4.055

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CoreStaff

Japan . 995 parts In-Stock

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$4.473

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$1.713

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$1.674

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$4.473

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Microchip USA

USA . 156 parts In-Stock

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$21.450

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$21.320

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$21.250

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Perfect Parts

USA . 69,692 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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Israel . 12,000 parts In-Stock

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Germany . 5,994 parts In-Stock

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Robosynatics

Brazil . 3,892 parts In-Stock

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Lucentia Tech

USA . 3,892 parts In-Stock

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Overview

Unlock the potential of your power system with the high-quality IR2110PBF MOSFET Gate Driver by Infineon Technologies. Designed for automotive applications, this rectangular package offers a maximum supply voltage of 520V and turn-on/off times as fast as 0.15us/0.125us. With dual terminal position and a nominal output peak current limit of 2.5A, this innovative technology ensures optimal performance and reliability. Trust Infineon's expertise to drive your projects forward with efficiency and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and protection for the internal components of the MOSFET gate driver.

Maximum Supply Voltage: 20 V

With a maximum supply voltage of 20V, this MOSFET gate driver can handle a wide range of power supply inputs, making it versatile for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing circuit designs and ensures space efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding environmental conditions.

Technology: CMOS

The CMOS technology used in this MOSFET gate driver offers high efficiency and low power consumption, making it a cost-effective and energy-efficient choice.

Nominal Output Peak Current Limit: 2.5 A

The nominal output peak current limit of 2.5A allows for robust and reliable operation of the MOSFETs, ensuring smooth switching and performance.

Technical Specifications

MOSFET Gate Drivers IR2110PBF attributes and parameters. Explore more MOSFET Gate Drivers devices from Infineon Technologies

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

19.305 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

15

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

20 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

15 V

Maximum Supply Voltage-1:

520 V

Minimum Supply Voltage-1:

6 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

.125 us

Turn-on Time:

.15 us

Width:

7.62 mm

Trade Compliance

IR2110PBF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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