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NCP303160MNTWG

Onsemi

NCP303160MNTWG by Onsemi

NCP303160MNTWG by Onsemi is a MOSFET Gate Driver with 39 terminals, operating at -40 to 125 °C. It has a supply voltage range of 4.5-5.5 V and peak reflow temp of 260 C. Ideal for automotive applications requiring high side drivers with fast turn-on/off times (32us/109us).

Median Price

$3.690

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,363 parts In-Stock

1+ parts

$3.690

100+ parts

$2.300

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3,363

$3.690

$2.300

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DigiKey

USA . 135 parts In-Stock

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$3.690

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$2.297

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$2.157

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135

$3.690

$2.297

$2.157

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Flip Electronics (Authorized)

USA . 168 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 870 parts In-Stock

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$2.141

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870

$2.141

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Digiode

USA . 1,923 parts In-Stock

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$4.380

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Chip Stock

USA . 24,000 parts In-Stock

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Vyrian

USA . 1,420 parts In-Stock

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Flip Electronics

USA . 168 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,144 parts In-Stock

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$2.141

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$2.098

6,144

$2.141

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$2.098

Argo Parts USA

USA . 4,332 parts In-Stock

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$2.141

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4,332

$2.141

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Netroflash

USA . 2,000 parts In-Stock

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$2.141

100+ parts

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$2.034

10k+ parts

$1.991

2,000

$2.141

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$2.034

$1.991

Advanced Electronics

New Zealand . 500 parts In-Stock

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$2.184

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$2.184

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$2.184

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500

$2.184

$2.184

$2.184

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Ampacity Inc.

Singapore . 1,574 parts In-Stock

1+ parts

$3.920

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Corphita

USA . 175 parts In-Stock

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$4.149

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$4.149

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Corohmni

South Africa . 497 parts In-Stock

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$4.310

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Aztec Data Supply Inc.

USA . 64 parts In-Stock

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$4.630

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Microchip USA

USA . 4,381 parts In-Stock

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$12.921

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Lixinc

USA . 10,034 parts In-Stock

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Kulean Microsystems

USA . 5,122 parts In-Stock

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TANS Electronics

Latvia . 5,019 parts In-Stock

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Problanco Electronics

Mexico . 3,498 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 1,876 parts In-Stock

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UHIMA Technologies

Türkiye . 228 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

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Overview

Enhance the performance and reliability of your electronic devices with the NCP303160MNTWG MOSFET Gate Driver by Onsemi. Manufactured with precision and expertise, this chip carrier package offers a wide range of applications in automotive technology. With a nominal supply voltage of 5V and a maximum operating temperature of 125°C, this gate driver ensures optimal functionality and durability under extreme conditions. Experience seamless operation and improved efficiency with this high-quality product, setting new standards in the industry. Elevate your projects with the NCP303160MNTWG and unlock endless possibilities in electronics innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications in different industries.

Surface Mount: YES

This surface mount feature allows for easy and convenient installation, saving time and effort during the assembly process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this product ensures stable and reliable performance within the specified operating range.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, making it suitable for space-constrained applications without compromising performance.

No. of Terminals: 39

The 39 terminals offer ample connectivity options, allowing for versatile integration into various circuits and systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier style with heat sink/slug and thin profile design enhances heat dissipation and thermal management for improved reliability.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures that the product operates efficiently even under low voltage conditions.

Maximum Operating Temperature: 125 °C

The high operating temperature of 125°C enables the product to withstand elevated temperatures, ensuring reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product is suitable for use in cold environments or applications that require extended temperature ranges.

Terminal Finish: MATTE TIN

The matte tin finish provides enhanced conductivity and corrosion resistance, prolonging the lifespan of the product.

Terminal Position: QUAD

The quad terminal position allows for easy connection and installation, streamlining the overall circuit design process.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8mm is beneficial for applications with height restrictions, offering a compact and space-saving solution.

Width: 5 mm

The 5mm width provides a slim profile, making it suitable for applications where space is limited.

High Side Driver: YES

The inclusion of a high side driver feature enables efficient control and monitoring of high voltage components, enhancing system performance and safety.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures proper soldering and component reliability during the assembly process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without compromising performance.

Length: 6 mm

The 6mm length offers a compact form factor, making it suitable for applications where space optimization is critical.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification indicates that this product meets stringent quality and reliability standards required for automotive applications.

Technology: MOS

The MOS technology ensures high efficiency and performance with low power consumption, making this product an energy-efficient choice.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joint failures, enhancing the overall durability of the product.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with a wide range of systems and devices, making it a versatile choice for various applications.

Turn-on Time: 32 us

The fast turn-on time of 32 microseconds ensures quick response and precise control of MOSFETs, improving system efficiency and performance.

Terminal Pitch: 0.45 mm

The narrow terminal pitch of 0.45mm allows for high-density mounting, enabling the creation of compact and space-efficient circuit designs.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

The buffer or inverter-based interface IC type provides flexibility and compatibility with different control systems, enhancing the product's versatility.

Turn-off Time: 109 us

The turn-off time of 109 microseconds ensures efficient switching and control of MOSFETs, reducing power losses and improving overall system performance.

Technical Specifications

MOSFET Gate Drivers NCP303160MNTWG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

High Side Driver:

YES

JESD-30 Code:

R-PQCC-N39

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

39

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC39/40,.2X.24,18

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.45 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

109 us

Turn-on Time:

32 us

Width:

5 mm

Trade Compliance

NCP303160MNTWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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