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NCP302155MNTWG

Onsemi

NCP302155MNTWG by Onsemi

HALF BRIDGE BASED MOSFET DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 31; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$1.925

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,525 parts In-Stock

1+ parts

$2.350

100+ parts

$1.419

1k+ parts

$1.300

10k+ parts

-

4,525

$2.350

$1.419

$1.300

-

Mouser Electronics

USA . 3,902 parts In-Stock

1+ parts

$2.350

100+ parts

$1.420

1k+ parts

$1.280

10k+ parts

$1.140

3,902

$2.350

$1.420

$1.280

$1.140

Rochester

USA . 29,661 parts In-Stock

1+ parts

-

100+ parts

$1.440

1k+ parts

$1.200

10k+ parts

$1.070

29,661

-

$1.440

$1.200

$1.070

Verical

USA . 10,111 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

$1.337

10,111

-

-

$1.500

$1.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.810

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

$0.810

-

-

-

Digiode

USA . 641 parts In-Stock

1+ parts

$1.121

100+ parts

-

1k+ parts

-

10k+ parts

-

641

$1.121

-

-

-

DF Sales Co.

USA . 500 parts In-Stock

1+ parts

$1.140

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.140

-

-

-

DF Sales Co.

USA . 500 parts In-Stock

1+ parts

$1.140

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.140

-

-

-

Nova Conductors

Japan . 550 parts In-Stock

1+ parts

$1.308

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$1.308

-

-

-

Chip Stock

USA . 157,550 parts In-Stock

1+ parts

-

100+ parts

-

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157,550

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-

-

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Cyclops Electronics Ltd

UK . 60,708 parts In-Stock

1+ parts

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60,708

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-

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Vyrian

USA . 9,019 parts In-Stock

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-

100+ parts

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9,019

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,465 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

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8,465

$0.940

-

-

-

Corphita

USA . 1,674 parts In-Stock

1+ parts

$1.062

100+ parts

-

1k+ parts

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10k+ parts

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1,674

$1.062

-

-

-

Corohmni

South Africa . 358 parts In-Stock

1+ parts

$1.140

100+ parts

-

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10k+ parts

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358

$1.140

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.308

100+ parts

-

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1,000

$1.308

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Microchip USA

USA . 4,192 parts In-Stock

1+ parts

$7.906

100+ parts

-

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4,192

$7.906

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Perfect Parts

USA . 45,662 parts In-Stock

1+ parts

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45,662

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Lixinc

USA . 14,143 parts In-Stock

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14,143

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-

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Problanco Electronics

Mexico . 8,017 parts In-Stock

1+ parts

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8,017

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-

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Kulean Microsystems

USA . 7,557 parts In-Stock

1+ parts

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7,557

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-

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TANS Electronics

Latvia . 2,594 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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2,594

-

-

-

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SupplyDigital Components

Austria . 569 parts In-Stock

1+ parts

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100+ parts

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569

-

-

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UHIMA Technologies

Türkiye . 190 parts In-Stock

1+ parts

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190

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-

Technical Specifications

MOSFET Gate Drivers NCP302155MNTWG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PQCC-N31

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

31

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Nominal Output Peak Current Limit:

85 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.03 us

Turn-on Time:

.042 us

Width:

5 mm

Trade Compliance

NCP302155MNTWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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