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NCP302155AMNTWG

Onsemi

NCP302155AMNTWG by Onsemi

NCP302155AMNTWG by Onsemi is a MOSFET Gate Driver with 5.5V max supply voltage, 85A peak current limit, and -40 to 125 °C operating temperature range. Ideal for high side driver applications in various industries due to its compact square package design and standard input characteristics.

Median Price

$2.160

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,488 parts In-Stock

1+ parts

$2.160

100+ parts

$1.300

1k+ parts

$1.146

10k+ parts

$1.068

4,488

$2.160

$1.300

$1.146

$1.068

Mouser Electronics

USA . 4,408 parts In-Stock

1+ parts

$2.160

100+ parts

$1.310

1k+ parts

$1.150

10k+ parts

$1.100

4,408

$2.160

$1.310

$1.150

$1.100

Flip Electronics (Authorized)

USA . 138,000 parts In-Stock

1+ parts

-

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138,000

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Avnet

USA . 6,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

$3.269

6,000

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-

$3.269

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 775 parts In-Stock

1+ parts

$1.104

100+ parts

-

1k+ parts

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10k+ parts

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775

$1.104

-

-

-

Digiode

USA . 1,483 parts In-Stock

1+ parts

$2.898

100+ parts

-

1k+ parts

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10k+ parts

-

1,483

$2.898

-

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Flip Electronics

USA . 39,000 parts In-Stock

1+ parts

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39,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 220 parts In-Stock

1+ parts

$1.104

100+ parts

-

1k+ parts

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10k+ parts

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220

$1.104

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-

Corphita

USA . 1,431 parts In-Stock

1+ parts

$2.745

100+ parts

-

1k+ parts

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1,431

$2.745

-

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iodParts Technologies Inc.

India . 54,000 parts In-Stock

1+ parts

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100+ parts

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54,000

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Microchip USA

USA . 7,952 parts In-Stock

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7,952

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SupplyDigital Components

Austria . 6,086 parts In-Stock

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6,086

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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TANS Electronics

Latvia . 3,472 parts In-Stock

1+ parts

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3,472

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Kulean Microsystems

USA . 3,177 parts In-Stock

1+ parts

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3,177

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UHIMA Technologies

Türkiye . 399 parts In-Stock

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399

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Problanco Electronics

Mexico . 184 parts In-Stock

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184

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Overview

Enhance the performance of your electronic devices with the NCP302155AMNTWG MOSFET Gate Driver by Onsemi. Designed for reliability and efficiency, this surface-mount driver offers seamless integration into a variety of applications. With a wide operating temperature range and high output peak current limit, this product ensures optimal functionality in any environment. Trust Onsemi's reputable manufacturing standards to deliver top-quality products that exceed expectations. Upgrade your projects with the NCP302155AMNTWG for unparalleled value and performance.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, providing flexibility in various electronic applications.

Package Shape: SQUARE

Square package shape makes the product easy to handle and mount, ensuring a secure and stable connection.

No. of Terminals: 33

A higher number of terminals allow for more diverse connections and functionalities in the circuit design.

Minimum Supply Voltage: 4.5 V

Supports low supply voltages, making it compatible with a wide range of electronic devices and systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures durability and reliability even in harsh environments.

Minimum Operating Temperature: -40 °C

Can operate effectively in extreme cold temperatures, making it suitable for a variety of environments.

Terminal Position: QUAD

Quad terminal position provides stability and reliability in connecting the gate driver to the rest of the circuit.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Incorporates multiple package styles for efficient heat dissipation, compact design, and improved performance.

Maximum Seated Height: 0.8 mm

Low seated height allows for compact and slim device design, ideal for applications with space constraints.

Width: 5 mm

Narrow width facilitates easy integration into circuit layouts and design requirements.

Output Polarity: TRUE

True output polarity ensures accurate and consistent signal transmission, reducing errors in the circuit.

High Side Driver: YES

Supports high-side driving applications, providing versatility in circuit design and operation.

Length: 5 mm

Compact length allows for flexible placement in circuit layouts and space-saving designs.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of damage during installation and improves overall durability.

Maximum Supply Current: 2 mA

Low supply current requirement minimizes power consumption and enhances energy efficiency in operation.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of control signals and interface requirements.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V provides stable and reliable operation in most electronic systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise and accurate connections, reducing the risk of signal interference.

Nominal Output Peak Current Limit: 85 A

High output peak current limit of 85A enables robust and efficient performance in demanding applications.

Interface IC Type: BUFFER OR INVERTER BASED MOSFET DRIVER

Utilizes advanced interface IC type for efficient and reliable control of MOSFET devices, ensuring optimal performance.

Technical Specifications

MOSFET Gate Drivers NCP302155AMNTWG attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Input Characteristics:

STANDARD

JESD-30 Code:

S-XQCC-N33

Length:

5 mm

No. of Functions:

1

No. of Terminals:

33

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

85 A

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.8 mm

Maximum Supply Current:

2 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

NCP302155AMNTWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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