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NCP1850FCCT1G

Onsemi

NCP1850FCCT1G by Onsemi

NCP1850FCCT1G by Onsemi is a Power Management IC with 25 terminals, operating at -40 to 85 °C. It has a supply voltage range of 3.6V to 7V and comes in a square-shaped plastic package for surface mounting applications. Ideal for industrial use, this IC features a very thin profile and fine pitch grid array package style.

Median Price

$0.808

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 543,000 parts In-Stock

1+ parts

-

100+ parts

$0.793

1k+ parts

$0.658

10k+ parts

$0.587

543,000

-

$0.793

$0.658

$0.587

Verical

USA . 213,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.822

10k+ parts

$0.733

213,000

-

-

$0.822

$0.733

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 224 parts In-Stock

1+ parts

$0.618

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$0.618

-

-

-

Vyrian

USA . 6,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,424

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 80 parts In-Stock

1+ parts

$0.534

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$0.534

-

-

-

Corphita

USA . 1,276 parts In-Stock

1+ parts

$0.585

100+ parts

-

1k+ parts

-

10k+ parts

-

1,276

$0.585

-

-

-

Vigor

Singapore . 163 parts In-Stock

1+ parts

$0.620

100+ parts

-

1k+ parts

-

10k+ parts

-

163

$0.620

-

-

-

Component Stockers USA

USA . 659,758 parts In-Stock

1+ parts

$0.670

100+ parts

$0.630

1k+ parts

$0.570

10k+ parts

$0.570

659,758

$0.670

$0.630

$0.570

$0.570

AZTECH Wire

Italy . 899 parts In-Stock

1+ parts

$10.210

100+ parts

-

1k+ parts

-

10k+ parts

-

899

$10.210

-

-

-

Continental Prestige Electronics

USA . 543,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.515

10k+ parts

-

543,000

-

-

$0.515

-

SupplyDigital Components

Austria . 7,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,610

-

-

-

-

Kulean Microsystems

USA . 7,335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,335

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,678 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,678

-

-

-

-

Problanco Electronics

Mexico . 6,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,433

-

-

-

-

TANS Electronics

Latvia . 3,766 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,766

-

-

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-

UHIMA Technologies

Türkiye . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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489

-

-

-

-

Microchip USA

USA . 157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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157

-

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-

Overview

Discover the NCP1850FCCT1G by Onsemi, a top-quality Power Management IC that offers unparalleled reliability and efficiency. Manufactured by industry leader Onsemi, this innovative product is perfect for a wide range of applications in power supply management circuits. With a package style that is grid array, very thin profile, and fine pitch, this IC provides superior performance in industrial-grade environments. Experience the value and benefits of the NCP1850FCCT1G today and take your power management to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is commonly used in many electronic devices, making this power management IC versatile.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures stable performance even in demanding conditions.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB layout and space-saving design.

Technical Specifications

Power Management ICs NCP1850FCCT1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PBGA-B25

Length:

2.06 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3.6 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.06 mm

Trade Compliance

NCP1850FCCT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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