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NCP1835MN24T2G

Onsemi

NCP1835MN24T2G by Onsemi

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 10; Package Code: HVSON; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.766

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 709,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.650

10k+ parts

$0.650

709,870

-

-

$0.650

$0.650

Rochester

USA . 709,470 parts In-Stock

1+ parts

-

100+ parts

$0.766

1k+ parts

$0.636

10k+ parts

$0.567

709,470

-

$0.766

$0.636

$0.567

Verical

USA . 622,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.795

10k+ parts

$0.709

622,800

-

-

$0.795

$0.709

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 113 parts In-Stock

1+ parts

$0.517

100+ parts

-

1k+ parts

-

10k+ parts

-

113

$0.517

-

-

-

Digiode

USA . 1,589 parts In-Stock

1+ parts

$0.597

100+ parts

-

1k+ parts

-

10k+ parts

-

1,589

$0.597

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 109 parts In-Stock

1+ parts

$0.517

100+ parts

-

1k+ parts

-

10k+ parts

-

109

$0.517

-

-

-

Corphita

USA . 1,599 parts In-Stock

1+ parts

$0.565

100+ parts

-

1k+ parts

-

10k+ parts

-

1,599

$0.565

-

-

-

Component Stockers USA

USA . 765,384 parts In-Stock

1+ parts

$0.640

100+ parts

$0.600

1k+ parts

$0.540

10k+ parts

$0.540

765,384

$0.640

$0.600

$0.540

$0.540

Continental Prestige Electronics

USA . 709,870 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.498

10k+ parts

-

709,870

-

-

$0.498

-

SupplyDigital Components

Austria . 4,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,731

-

-

-

-

Problanco Electronics

Mexico . 3,873 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,873

-

-

-

-

TANS Electronics

Latvia . 2,021 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,021

-

-

-

-

Kulean Microsystems

USA . 623 parts In-Stock

1+ parts

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100+ parts

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623

-

-

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UHIMA Technologies

Türkiye . 244 parts In-Stock

1+ parts

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100+ parts

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244

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-

-

-

Microchip USA

USA . 210 parts In-Stock

1+ parts

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100+ parts

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210

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-

-

Technical Specifications

Power Management ICs NCP1835MN24T2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XDSO-N10

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

NCP1835MN24T2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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