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NCP1835MN20R2G

Onsemi

NCP1835MN20R2G by Onsemi

NCP1835MN20R2G by Onsemi is a Power Management IC with 10 terminals, Vsup ranging from 2.8V to 6.5V, and adjustable threshold feature. It is designed for power supply support circuits in commercial-grade applications, operates b/w 0-70 °C, and comes in a small outline package shape suitable for surface mount assembly.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

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Digiode

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AZTECH Wire

Italy . 1,059 parts In-Stock

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Metaverse IC Inc.

Canada . 54,230 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,703 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

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A-Z Elektronik GmbH

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SupplyDigital Components

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TANS Electronics

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Corphita

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Emar International I/E

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Microchip USA

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Overview

Discover the power of efficiency with the NCP1835MN20R2G from Onsemi. As a leader in Power Management ICs, Onsemi delivers top-notch quality and reliability for your power supply needs. This rectangular-shaped Surface Mount package offers a nominal supply voltage of 5V, making it perfect for various applications. With 10 terminals and a very thin profile, this IC provides exceptional performance while maintaining a compact design. Trust Onsemi to provide the innovative solutions you need for your next project. Unlock the potential of the NCP1835MN20R2G and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Makes it suitable for easy and convenient assembly onto circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Provides a standard voltage level for compatibility with various electronic devices.

Power Supplies (V): 3/5

Supports multiple power supplies, offering flexibility in power management.

Maximum Operating Temperature: 70 °C

Ensures reliable performance in high temperature environments.

Minimum Operating Temperature: 0 °C

Allows for operation in a wide range of temperature conditions.

Terminal Finish: TIN

Provides corrosion resistance and good solderability.

Maximum Seated Height: 1 mm

Compact size for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically to support power supply functions, ensuring efficiency and reliability.

Minimum Supply Voltage (Vsup): 2.8 V

Allows for operation at lower voltage levels, increasing energy efficiency.

Adjustable Threshold: YES

Ability to adjust threshold levels provides customization for specific application requirements.

Technical Specifications

Power Management ICs NCP1835MN20R2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XDSO-N10

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

NCP1835MN20R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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