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NCP1835MN24R2G

Onsemi

NCP1835MN24R2G by Onsemi

NCP1835MN24R2G by Onsemi is a Power Management IC with 5V Nominal Voltage, 10 Terminals, and 3/5 V Power Supplies. It is used in power supply support circuits due to its small outline package style and adjustable threshold feature. Operating temperature ranges from 0 to 70 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,465 parts In-Stock

1+ parts

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1,465

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Vyrian

USA . 926 parts In-Stock

1+ parts

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926

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 765 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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10k+ parts

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765

$0.500

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TANS Electronics

Latvia . 6,585 parts In-Stock

1+ parts

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6,585

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SupplyDigital Components

Austria . 5,420 parts In-Stock

1+ parts

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5,420

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Kulean Microsystems

USA . 2,185 parts In-Stock

1+ parts

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2,185

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Corphita

USA . 1,185 parts In-Stock

1+ parts

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1,185

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Problanco Electronics

Mexico . 1,050 parts In-Stock

1+ parts

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1,050

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UHIMA Technologies

Türkiye . 455 parts In-Stock

1+ parts

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455

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Corohmni

South Africa . 349 parts In-Stock

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349

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Overview

Unleash the power of efficient energy management with the NCP1835MN24R2G by Onsemi. This high-quality Power Management IC is designed to optimize power supplies, ensuring smooth operation and reliable performance. With a compact surface mount package and adjustable threshold feature, this product offers flexibility and convenience for various applications. Whether you're looking to enhance battery life in portable devices or improve power efficiency in industrial equipment, the NCP1835MN24R2G delivers exceptional value and benefits that cater to your specific needs. Upgrade your power management solutions today with Onsemi's innovative technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product suitable for mass production.

Nominal Supply Voltage (Vsup): 5 V

This product operates at a commonly used supply voltage, making it compatible with many existing systems and applications.

No. of Terminals: 10

Having a higher number of terminals allows for more functionality and connectivity options, making this product versatile for various power management applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand higher temperatures without compromising performance or reliability.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the product can function in a wide range of environmental conditions.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The compact and heat-dissipating package style makes this product suitable for space-constrained applications while ensuring efficient thermal management.

Technical Specifications

Power Management ICs NCP1835MN24R2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XDSO-N10

JESD-609 Code:

e3

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

NCP1835MN24R2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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