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NCP1096PAG

Onsemi

NCP1096PAG by Onsemi

NCP1096PAG by Onsemi is a Power Management IC with 16 terminals, operating at -40 to 125 °C. It supports a supply voltage range of 0-57 V and has a small outline package style. Ideal for automotive applications due to its high temperature grade and moisture sensitivity level of 2.

Median Price

$0.500

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Future Electronics

Canada . 192 parts In-Stock

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Vyrian

USA . 12,804 parts In-Stock

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Flip Electronics

USA . 1,832 parts In-Stock

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Digiode

USA . 220 parts In-Stock

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IBS Electronics

USA . 192 parts In-Stock

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$0.650

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$0.650

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Corohmni

South Africa . 472 parts In-Stock

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$1.650

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Vigor

Singapore . 500 parts In-Stock

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$2.418

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$2.418

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AZTECH Wire

Italy . 681 parts In-Stock

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$10.690

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Microchip USA

USA . 1,874 parts In-Stock

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$17.614

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$29.251

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$26.618

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$23.986

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$29.251

$26.618

$23.986

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iodParts Technologies Inc.

India . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 5,021 parts In-Stock

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Kulean Microsystems

USA . 3,615 parts In-Stock

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SupplyDigital Components

Austria . 3,145 parts In-Stock

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Corphita

USA . 2,086 parts In-Stock

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TANS Electronics

Latvia . 1,479 parts In-Stock

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UHIMA Technologies

Türkiye . 71 parts In-Stock

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Overview

Unlock the power of efficient energy management with the NCP1096PAG by Onsemi. Designed with precision and reliability in mind, this Power Management IC offers unparalleled performance for a wide range of applications. From automotive systems to industrial machinery, this product ensures optimal power supply support circuitry while maintaining a compact and durable design. Experience the seamless integration of quality and innovation with Onsemi's NCP1096PAG, providing you with the value and benefits you need for your projects to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, suitable for a variety of applications.

Surface Mount: YES

Being surface mount, this product is easy to install on circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 12.5 V

With a stable nominal supply voltage of 12.5V, this Power Management IC ensures consistent power delivery to connected devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows this IC to operate reliably even in harsh industrial or automotive environments.

Width (mm): 4.4 mm

The compact width of 4.4mm helps in saving space on the PCB and allows for more efficient layout designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, this Power Management IC meets the stringent requirements of the automotive industry in terms of reliability and performance.

Technical Specifications

Power Management ICs NCP1096PAG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

12.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

NCP1096PAG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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