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NCP1855FCCT1G

Onsemi

NCP1855FCCT1G by Onsemi

NCP1855FCCT1G by Onsemi is a Power Management IC with 25 terminals, operating voltage range of 3.9-7V, and industrial temperature grade. It features a very thin profile package style suitable for power supply management circuits in various applications.

Median Price

$0.978

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 131,675 parts In-Stock

1+ parts

-

100+ parts

$0.978

1k+ parts

$0.811

10k+ parts

$0.723

131,675

-

$0.978

$0.811

$0.723

Farnell

UK . 131,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.606

131,675

-

-

-

$0.606

Verical

USA . 128,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.014

10k+ parts

$0.904

128,675

-

-

$1.014

$0.904

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$0.761

100+ parts

-

1k+ parts

-

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45

$0.761

-

-

-

Digiode

USA . 356 parts In-Stock

1+ parts

$0.762

100+ parts

-

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-

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356

$0.762

-

-

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Vyrian

USA . 4,873 parts In-Stock

1+ parts

-

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-

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4,873

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 131,579 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

131,579

$0.520

-

-

-

Corohmni

South Africa . 326 parts In-Stock

1+ parts

$0.606

100+ parts

-

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-

326

$0.606

-

-

-

Corphita

USA . 222 parts In-Stock

1+ parts

$0.722

100+ parts

-

1k+ parts

-

10k+ parts

-

222

$0.722

-

-

-

Argo Parts USA

USA . 3,941 parts In-Stock

1+ parts

$0.761

100+ parts

-

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-

10k+ parts

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3,941

$0.761

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-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$0.761

100+ parts

-

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100

$0.761

-

-

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Vigor

Singapore . 904 parts In-Stock

1+ parts

$0.770

100+ parts

-

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10k+ parts

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904

$0.770

-

-

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AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$20.630

100+ parts

-

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344

$20.630

-

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Aztec Data Supply Inc.

USA . 2,280 parts In-Stock

1+ parts

$24.230

100+ parts

-

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2,280

$24.230

-

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Continental Prestige Electronics

USA . 131,675 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.580

10k+ parts

-

131,675

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-

$0.580

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RC Electronics

USA . 9,000 parts In-Stock

1+ parts

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9,000

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A-Z Elektronik GmbH

Germany . 7,136 parts In-Stock

1+ parts

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7,136

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TANS Electronics

Latvia . 6,325 parts In-Stock

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6,325

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SupplyDigital Components

Austria . 5,741 parts In-Stock

1+ parts

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5,741

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Problanco Electronics

Mexico . 3,746 parts In-Stock

1+ parts

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3,746

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Kepictronics

USA . 1,080 parts In-Stock

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1,080

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Kulean Microsystems

USA . 730 parts In-Stock

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730

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Futuretech Components

Singapore . 697 parts In-Stock

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697

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UHIMA Technologies

Türkiye . 577 parts In-Stock

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577

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Microchip USA

USA . 234 parts In-Stock

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234

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Formix International (Excess)

India . 142 parts In-Stock

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142

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Overview

Enhance your power management solutions with the NCP1855FCCT1G by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This Power Management IC is designed to meet the demanding requirements of various applications, offering unmatched performance and efficiency. Its compact package body material ensures durability while its surface mount design enhances ease of installation. With a wide range of operating temperatures and voltage options, this IC caters to diverse needs. Trust Onsemi's expertise and elevate your projects with the NCP1855FCCT1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and helps in reducing the overall weight of the product.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage ensures compatibility with a wide range of systems and applications.

No. of Terminals: 25

The higher number of terminals allows for more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliability.

Width (mm): 2.2 mm

The compact width of 2.2mm makes this product suitable for space-constrained applications where size is a critical factor.

Minimum Supply Voltage (Vsup): 3.9 V

The minimum supply voltage of 3.9V allows for operation in low power scenarios, making it versatile for a variety of power management applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures stable performance in harsh operating conditions typically found in industrial settings.

Terminal Pitch: 0.4 mm

The fine pitch of 0.4mm enables high-density mounting, contributing to space-saving designs and improved circuit efficiency.

Technical Specifications

Power Management ICs NCP1855FCCT1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B25

Length:

2.55 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.9/7

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

3.9 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.2 mm

Trade Compliance

NCP1855FCCT1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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