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NCP1835MN24T2

Onsemi

NCP1835MN24T2 by Onsemi

NCP1835MN24T2 by Onsemi is a Power Management IC with 3/5 V power supplies, 10 terminals, and 5V nominal voltage. It is used in power supply support circuits, featuring a small outline package style suitable for commercial temperature grades.

Median Price

$0.686

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.559

10k+ parts

$0.498

6,000

-

$0.674

$0.559

$0.498

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.699

10k+ parts

-

6,000

-

-

$0.699

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,485 parts In-Stock

1+ parts

$0.524

100+ parts

-

1k+ parts

-

10k+ parts

-

1,485

$0.524

-

-

-

Vyrian

USA . 3,172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,172

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 338 parts In-Stock

1+ parts

$0.454

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$0.454

-

-

-

Corphita

USA . 2,117 parts In-Stock

1+ parts

$0.497

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

$0.497

-

-

-

Ampacity Inc.

Singapore . 7,353 parts In-Stock

1+ parts

$0.840

100+ parts

-

1k+ parts

-

10k+ parts

-

7,353

$0.840

-

-

-

AZTECH Wire

Italy . 366 parts In-Stock

1+ parts

$12.450

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$12.450

-

-

-

A-Z Elektronik GmbH

Germany . 7,263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,263

-

-

-

-

Kulean Microsystems

USA . 6,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,364

-

-

-

-

Continental Prestige Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.437

10k+ parts

-

6,000

-

-

$0.437

-

Problanco Electronics

Mexico . 5,428 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,428

-

-

-

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SupplyDigital Components

Austria . 4,758 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,758

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-

-

-

TANS Electronics

Latvia . 3,576 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,576

-

-

-

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UHIMA Technologies

Türkiye . 845 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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845

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Microchip USA

USA . 464 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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464

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Overview

Upgrade your power management system with the NCP1835MN24T2 by Onsemi. This high-quality Power Management IC offers unparalleled reliability and efficiency, making it an ideal choice for a wide range of applications. With surface mount capabilities and a compact rectangular package shape, this product is both versatile and easy to integrate into various systems. Enhance your power supplies with the NCP1835MN24T2 and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 5 V

Standard 5V supply voltage is widely used and compatible with many electronic devices.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with a heat sink allows for efficient heat dissipation in confined spaces.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability even under demanding conditions.

Minimum Supply Voltage (Vsup): 2.8 V

Low minimum supply voltage allows for flexibility in power input requirements.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization based on specific application requirements.

Technical Specifications

Power Management ICs NCP1835MN24T2 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XDSO-N10

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

NCP1835MN24T2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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