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NCP112PG

Onsemi

NCP112PG by Onsemi

NCP112PG by Onsemi is a Power Management IC with 14 terminals, 5V nominal voltage, and 16V max supply voltage. It has an adjustable threshold and is used in power supply support circuits for applications requiring a temperature range of 0-85 °C.

Median Price

$0.524

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,045 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

2,045

-

$0.515

$0.428

$0.381

Verical

USA . 1,475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.534

10k+ parts

$0.476

1,475

-

-

$0.534

$0.476

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,873 parts In-Stock

1+ parts

$0.401

100+ parts

-

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-

10k+ parts

-

1,873

$0.401

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-

-

Vyrian

USA . 7,316 parts In-Stock

1+ parts

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7,316

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 164 parts In-Stock

1+ parts

$0.380

100+ parts

-

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164

$0.380

-

-

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Vigor

Singapore . 705 parts In-Stock

1+ parts

$0.410

100+ parts

-

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705

$0.410

-

-

-

Corohmni

South Africa . 274 parts In-Stock

1+ parts

$0.422

100+ parts

-

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274

$0.422

-

-

-

AZTECH Wire

Italy . 1,137 parts In-Stock

1+ parts

$11.500

100+ parts

-

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1,137

$11.500

-

-

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$26.064

100+ parts

$23.718

1k+ parts

$21.372

10k+ parts

-

2,500

$26.064

$23.718

$21.372

-

Kulean Microsystems

USA . 7,979 parts In-Stock

1+ parts

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7,979

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Problanco Electronics

Mexico . 5,274 parts In-Stock

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5,274

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SupplyDigital Components

Austria . 3,818 parts In-Stock

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3,818

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Continental Prestige Electronics

USA . 2,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.500

10k+ parts

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2,045

-

-

$0.500

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TANS Electronics

Latvia . 971 parts In-Stock

1+ parts

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971

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UHIMA Technologies

Türkiye . 508 parts In-Stock

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508

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Microchip USA

USA . 421 parts In-Stock

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421

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Overview

Enhance your power management solutions with the NCP112PG by Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge Power Management ICs designed to optimize performance and efficiency. The NCP112PG offers customers unmatched value with its versatile applications in various electronic devices. Experience the benefits of seamless power supply support circuitry, adjustable threshold capabilities, and a wide operating temperature range. Trust Onsemi to provide you with the competitive edge needed to stay ahead in today's fast-paced market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and resistance to heat, making the product reliable for long-term use.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common standard in many electronic devices, ensuring compatibility with a wide range of applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand a wide range of environmental conditions, making it versatile and reliable.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring stable and efficient performance of the product.

Width (mm): 7.62 mm

The compact width of the package allows for space-saving installation in various electronic devices, making it ideal for applications with limited space.

Minimum Supply Voltage (Vsup): 4.5 V

With a low minimum supply voltage, this product can operate efficiently even in low-power applications, providing flexibility in design and usage.

Maximum Supply Current (Isup): 5 mA

The low maximum supply current requirement of 5 mA indicates energy efficiency, making the product suitable for battery-powered devices or applications with limited power capacity.

Technical Specifications

Power Management ICs NCP112PG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.69 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NCP112PG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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