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NCP1095DB

Onsemi

NCP1095DB by Onsemi

NCP1095DB by Onsemi is a Power Management IC with 16 terminals in a small outline package. It operates b/w -40 to 125°C, supporting power supply circuits. With a max supply voltage of 57V and peak reflow temperature of 260°C, it's ideal for automotive applications.

Median Price

$1.630

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 6 parts In-Stock

1+ parts

$0.188

100+ parts

-

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6

$0.188

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Chip1Stop

Japan . 6 parts In-Stock

1+ parts

$1.280

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-

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6

$1.280

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DigiKey

USA . 264 parts In-Stock

1+ parts

$1.980

100+ parts

$1.189

1k+ parts

$1.135

10k+ parts

-

264

$1.980

$1.189

$1.135

-

Mouser Electronics

USA . 34 parts In-Stock

1+ parts

$2.150

100+ parts

$1.460

1k+ parts

$1.240

10k+ parts

$0.915

34

$2.150

$1.460

$1.240

$0.915

Flip Electronics (Authorized)

USA . 1,629 parts In-Stock

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-

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1,629

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Verical

USA . 6 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,112 parts In-Stock

1+ parts

$0.179

100+ parts

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2,112

$0.179

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Nova Conductors

Japan . 75 parts In-Stock

1+ parts

$1.438

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75

$1.438

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Chip Stock

USA . 8,279 parts In-Stock

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8,279

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Vyrian

USA . 8,155 parts In-Stock

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8,155

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Flip Electronics

USA . 1,629 parts In-Stock

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1,629

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Distributors (Availability)

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Ampacity Inc.

Singapore . 412 parts In-Stock

1+ parts

$0.160

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412

$0.160

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Semicontronic

India . 349 parts In-Stock

1+ parts

$0.160

100+ parts

$0.156

1k+ parts

$0.155

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349

$0.160

$0.156

$0.155

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Corphita

USA . 506 parts In-Stock

1+ parts

$0.169

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506

$0.169

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Corohmni

South Africa . 171 parts In-Stock

1+ parts

$0.704

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171

$0.704

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Continental Prestige Electronics

USA . 2,862 parts In-Stock

1+ parts

$1.438

100+ parts

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10k+ parts

$1.409

2,862

$1.438

-

-

$1.409

Argo Parts USA

USA . 974 parts In-Stock

1+ parts

$1.438

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974

$1.438

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Netroflash

USA . 100 parts In-Stock

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$1.438

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$1.366

10k+ parts

$1.337

100

$1.438

-

$1.366

$1.337

Vigor

Singapore . 230 parts In-Stock

1+ parts

$1.960

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230

$1.960

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Aztec Data Supply Inc.

USA . 655 parts In-Stock

1+ parts

$3.410

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655

$3.410

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Microchip USA

USA . 2,176 parts In-Stock

1+ parts

$17.190

100+ parts

$16.950

1k+ parts

$16.820

10k+ parts

$16.700

2,176

$17.190

$16.950

$16.820

$16.700

Problanco Electronics

Mexico . 8,296 parts In-Stock

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Kulean Microsystems

USA . 6,871 parts In-Stock

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SupplyDigital Components

Austria . 3,779 parts In-Stock

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UHIMA Technologies

Türkiye . 672 parts In-Stock

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672

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TANS Electronics

Latvia . 345 parts In-Stock

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345

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Overview

Unlock the power of efficient and reliable power management with the NCP1095DB by Onsemi. Manufactured by a trusted industry leader, this Power Management IC offers unparalleled quality and performance. Ideal for automotive applications, this compact and durable device ensures optimal power supply support without compromising on safety or efficiency. Say goodbye to power-related issues and hello to seamless operations with the NCP1095DB. Trust Onsemi to deliver the best in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good insulation and protection for the IC.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to design and integrate into PCB layouts.

No. of Terminals: 16

Sufficient number of terminals for connectivity needs.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various operating conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable terminal finish for reliable connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout.

Maximum Seated Height: 1.2 mm

Low profile design for space-constrained applications.

Width (mm): 4.4 mm

Narrow width for compact PCB design.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power management applications.

Minimum Supply Voltage (Vsup): 0 V

Low minimum supply voltage allows for flexibility in power source selection.

Maximum Time At Peak Reflow Temperature (s): 30

Provides adequate time for solder reflow process during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable solder joints.

Length: 5 mm

Compact length for space-saving designs.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications with robust temperature requirements.

Terminal Form: GULL WING

Gull wing terminal form for easy surface mounting.

Terminal Pitch: 0.65 mm

Fine terminal pitch for precise PCB layout.

Moisture Sensitivity Level (MSL): 3

Medium moisture sensitivity level for safe storage and handling.

Maximum Supply Voltage (Vsup): 57 V

High maximum supply voltage for versatile power supply options.

Technical Specifications

Power Management ICs NCP1095DB attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

NCP1095DB Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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