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NCP112DG

Onsemi

NCP112DG by Onsemi

NCP112DG by Onsemi is a Power Management IC with 14 terminals, operating voltage of 5V, and adjustable threshold. It is used in power supply support circuits for applications requiring a small outline package style and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,679 parts In-Stock

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Digiode

USA . 2,085 parts In-Stock

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Ampacity Inc.

Singapore . 812 parts In-Stock

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$0.500

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Vigor

Singapore . 797 parts In-Stock

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$0.800

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AZTECH Wire

Italy . 1,018 parts In-Stock

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$15.550

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Component Stockers USA

USA . 728 parts In-Stock

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$99.990

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728

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SupplyDigital Components

Austria . 3,041 parts In-Stock

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Corphita

USA . 2,482 parts In-Stock

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Kulean Microsystems

USA . 1,464 parts In-Stock

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TANS Electronics

Latvia . 957 parts In-Stock

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Problanco Electronics

Mexico . 668 parts In-Stock

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Corohmni

South Africa . 129 parts In-Stock

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Microchip USA

USA . 108 parts In-Stock

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UHIMA Technologies

Türkiye . 18 parts In-Stock

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Overview

Enhance the efficiency of your power management system with the NCP112DG by Onsemi. Crafted with precision and reliability in mind, this Power Management IC offers unparalleled performance and durability. Whether you're in need of a solution for consumer electronics, industrial equipment, or automotive applications, this compact and versatile device delivers exceptional value and benefits to meet your power supply needs. Trust Onsemi's expertise and innovation to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability makes it easy to integrate into various PCB designs, saving space and providing flexibility in placement.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common 5V power supplies, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding environmental conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and solderability for secure connections.

Width (mm): 3.9 mm

Small width makes the package compact and space-efficient, ideal for designs with size constraints.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for operation in low-power scenarios, increasing versatility.

Maximum Supply Current (Isup): 5 mA

Low maximum supply current ensures efficient power usage and reduces power consumption in the system.

Technical Specifications

Power Management ICs NCP112DG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NCP112DG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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