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MTP1306

Onsemi

MTP1306 by Onsemi

The Onsemi MTP1306 is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 225A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.0085 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, it has a max power dissipation of 150W and can handle up to 75A drain current.

Median Price

$1.245

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 73,180 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$0.996

10k+ parts

$0.888

73,180

-

$1.200

$0.996

$0.888

DigiKey

USA . 73,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.500

10k+ parts

-

73,180

-

-

$1.500

-

Verical

USA . 73,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.245

10k+ parts

$1.110

73,180

-

-

$1.245

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,082 parts In-Stock

1+ parts

$0.813

100+ parts

-

1k+ parts

-

10k+ parts

-

1,082

$0.813

-

-

-

Digiode

USA . 1,858 parts In-Stock

1+ parts

$0.937

100+ parts

-

1k+ parts

-

10k+ parts

-

1,858

$0.937

-

-

-

ABC Electronics Ltd.

UK . 1,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,950

-

-

-

-

Florida Circuit

USA . 645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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645

-

-

-

-

Inventory MP

USA . 275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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275

-

-

-

-

Bristol Electronics

USA . 275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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275

-

-

-

-

Prism Electronics

USA . 69 parts In-Stock

1+ parts

-

100+ parts

-

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-

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69

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 436 parts In-Stock

1+ parts

$0.813

100+ parts

-

1k+ parts

-

10k+ parts

-

436

$0.813

-

-

-

Corphita

USA . 647 parts In-Stock

1+ parts

$0.887

100+ parts

-

1k+ parts

-

10k+ parts

-

647

$0.887

-

-

-

Continental Prestige Electronics

USA . 73,180 parts In-Stock

1+ parts

-

100+ parts

$0.904

1k+ parts

-

10k+ parts

-

73,180

-

$0.904

-

-

Kepictronics

USA . 27,860 parts In-Stock

1+ parts

-

100+ parts

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27,860

-

-

-

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Problanco Electronics

Mexico . 6,932 parts In-Stock

1+ parts

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100+ parts

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6,932

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,999 parts In-Stock

1+ parts

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-

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5,999

-

-

-

-

SupplyDigital Components

Austria . 4,766 parts In-Stock

1+ parts

-

100+ parts

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4,766

-

-

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Kulean Microsystems

USA . 4,555 parts In-Stock

1+ parts

-

100+ parts

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-

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4,555

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,500

-

-

-

-

TANS Electronics

Latvia . 2,787 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,787

-

-

-

-

UHIMA Technologies

Türkiye . 429 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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429

-

-

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Perfect Parts

USA . 77 parts In-Stock

1+ parts

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100+ parts

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77

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Overview

Experience unparalleled performance and reliability with the MTP1306 by Onsemi. As a leading manufacturer in the industry, Onsemi's Power Field Effect Transistor (FET) offers exceptional quality and durability for your switching applications. With a single configuration featuring a built-in diode, this N-channel transistor provides efficient power management with a maximum drain current of 75A. Trust in the advanced technology of Onsemi to deliver outstanding results while maximizing power dissipation and ensuring long-term stability. Upgrade your systems with the MTP1306 and unlock a new level of efficiency and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this Power FET durable and resistant to external elements, ensuring a longer lifespan.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the single configuration simplifies circuit design and saves space, making this Power FET a convenient choice for applications.

Transistor Application: SWITCHING

The switching application of this Power FET allows for efficient switching operations, making it suitable for various power management applications.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this Power FET can handle higher voltages, making it versatile for different voltage requirements.

Maximum Pulsed Drain Current (IDM): 225 A

The high pulsed drain current rating of 225A ensures that this Power FET can handle high current loads, making it suitable for power-intensive applications.

Maximum Power Dissipation (Abs): 150 W

The maximum power dissipation of 150W allows this Power FET to dissipate heat efficiently, ensuring reliable performance under various operating conditions.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this Power FET can operate in high-temperature environments without compromising performance, making it reliable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) MTP1306 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

280 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

225 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP1306 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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