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MTP12N10E

Onsemi

MTP12N10E by Onsemi

MTP12N10E by Onsemi is a Power FET with N-CHANNEL polarity, 100V DS breakdown voltage, and 30A IDM. Ideal for switching applications due to its single configuration with built-in diode. Features include 290mJ EAS, 0.16ohm RDS(on), and 79W max power dissipation.

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Century Electronics Ltd.

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LittleDiode

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J2 Sourcing AB

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Odintec Ltd.

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Legend Electronics Inc.

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Metaverse IC Inc.

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Kulean Microsystems

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Overview

Discover the incredible MTP12N10E by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. Manufactured with precision and expertise by Onsemi, this N-CHANNEL transistor offers customers reliability, efficiency, and performance. With a maximum drain current of 12 A and a low on-resistance of 0.16 ohm, this transistor ensures optimal power dissipation and operation. Ideal for a wide range of electronic devices, the MTP12N10E is a valuable component that brings enhanced functionality and durability to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have better performance characteristics compared to P-Channel FETs, making this product a good choice for applications where efficiency is key.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and can protect the device from voltage spikes, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast and efficient switching, making it ideal for power management systems.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle higher voltages, providing better protection against voltage surges.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier mounting and connection in various electronic circuits, enhancing the usability of the product.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easier to solder and install the FET securely, ensuring reliable connections in the circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are more versatile and easier to control, offering better efficiency and performance in various applications.

Maximum Pulsed Drain Current (IDM): 30 A

With a high maximum pulsed drain current of 30A, this FET can handle high power requirements and short-duration peak currents effectively.

Avalanche Energy Rating (EAS): 290 mJ

The high avalanche energy rating enables the FET to withstand sudden energy spikes, ensuring reliable operation in demanding conditions.

Maximum Drain Current (Abs) (ID): 12 A

The maximum drain current of 12A allows this FET to handle moderate power loads efficiently, making it suitable for a wide range of applications.

No. of Terminals: 3

With 3 terminals, this FET is easy to integrate into circuits and offers flexibility in connection options for various applications.

Maximum Power Dissipation (Abs): 79 W

The high maximum power dissipation rating of 79W ensures that the FET can handle power efficiently without overheating, enhancing its reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and thermal management, making it suitable for applications where heat dissipation is important.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides better performance and efficiency compared to other types of FETs, making this product a reliable choice.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperatures, making it suitable for demanding industrial environments.

Transistor Element Material: SILICON

Silicon-based transistor elements offer good performance characteristics and reliability, making this FET a durable and efficient choice for various applications.

Terminal Finish: Tin/Lead (Sn/Pb)

The terminal finish of tin/lead ensures good solderability and reliability, making it easy to integrate this FET into electronic circuits securely.

Maximum Drain-Source On Resistance: 0.16 ohm

With a low maximum drain-source on resistance of 0.16 ohm, this FET offers efficient power transfer and minimal power loss, making it suitable for high-efficiency applications.

Terminal Position: SINGLE

With a single terminal position, this FET is easy to install and connect in circuits, ensuring reliable performance in various applications.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and rugged design, making this FET suitable for applications where thermal management is important.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reliability during the manufacturing process, enhancing the quality of the product.

Peak Reflow Temperature °C: 235

With a peak reflow temperature of 235 °C, this FET can withstand high-temperature soldering processes, ensuring a secure connection in electronic circuits.

Technical Specifications

Power Field Effect Transistors (FET) MTP12N10E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

290 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP12N10E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

NSN

5961-01-358-2511, 5961013582511

NIIN

013582511

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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