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MTP1N100E

Onsemi

MTP1N100E by Onsemi

The Onsemi MTP1N100E is a N-CHANNEL Power FET with 1000V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a 3A IDM and 45mJ EAS. The transistor has a single configuration with built-in diode, operates in ENHANCEMENT MODE, and has a max power dissipation of 75W.

Median Price

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Lifecycle Status

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Lantek

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Digiode

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Vyrian

USA . 777 parts In-Stock

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Component Electronics Inc.

Canada . 87 parts In-Stock

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Sogenti Electronics

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A&K Electronics

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Bristol Electronics

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Sunrise Surplus Inc.

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Pegasus Components GmbH

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Prism Electronics

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ECAB

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LittleDiode

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Kepictronics

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Problanco Electronics

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Kulean Microsystems

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Corohmni

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Overview

Unlock the power of high-quality performance with the MTP1N100E by Onsemi, a top-tier manufacturer in the field of Power Field Effect Transistors (FET). This N-CHANNEL transistor boasts a range of applications, making it a versatile choice for switching needs. With its built-in diode and enhancement mode operation, this product offers customers exceptional value, benefits, and advantages. Trust Onsemi to deliver reliability and innovation in every component, ensuring optimal performance and efficiency in all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the transistor suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching and control capabilities in electronic circuits, enhancing performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance and efficient power management.

Minimum DS Breakdown Voltage: 1000 V

Capable of handling high voltages, making it suitable for industrial and high-power applications.

Maximum Pulsed Drain Current (IDM): 3 A

High pulse current rating allows for handling sudden surge currents without damage, improving overall reliability.

Maximum Power Dissipation (Abs): 75 W

Higher power dissipation capability ensures the transistor can handle heat generated during operation, increasing longevity.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without degradation, making it suitable for industrial environments with varying temperature conditions.

Maximum Drain-Source On Resistance: 9 ohm

Low on-resistance leads to efficient power handling and minimal power loss, improving overall performance.

Technical Specifications

Power Field Effect Transistors (FET) MTP1N100E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

45 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1000 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

3 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP1N100E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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