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MTP12N08EZL

Onsemi

MTP12N08EZL by Onsemi

MTP12N08EZL by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage. It features 36A IDM for SWITCHING applications. With a max power dissipation of 45W, it operates in ENHANCEMENT MODE and has a Drain-Source On Resistance of 0.18 ohm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,120 parts In-Stock

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Digiode

USA . 2,004 parts In-Stock

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TANS Electronics

Latvia . 5,199 parts In-Stock

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Kulean Microsystems

USA . 5,040 parts In-Stock

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Problanco Electronics

Mexico . 1,552 parts In-Stock

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UHIMA Technologies

Türkiye . 721 parts In-Stock

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SupplyDigital Components

Austria . 498 parts In-Stock

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Corphita

USA . 292 parts In-Stock

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Corohmni

South Africa . 117 parts In-Stock

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Overview

Discover the MTP12N08EZL by Onsemi, a top-quality Power FET that delivers exceptional performance in switching applications. With a robust design and built-in diode and resistor, this N-CHANNEL transistor offers unparalleled reliability and efficiency. Ideal for a wide range of electronic devices, this product provides a seamless user experience with its enhanced mode operation and high power dissipation capabilities. Trust Onsemi's expertise in semiconductor technology to bring you cutting-edge solutions for your power management needs. Experience the difference with the MTP12N08EZL and unlock new possibilities in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high electron mobility, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 60 V

The high breakdown voltage ensures that the transistor can handle high voltages without failing.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and reduce component count, saving space and cost.

Maximum Pulsed Drain Current (IDM): 36 A

The high pulsed drain current rating allows the FET to handle sudden surges in current without damage.

Maximum Power Dissipation (Abs): 45 W

The high power dissipation rating indicates that the transistor can handle high power loads without overheating.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures reliable performance in a variety of environmental conditions.

Maximum Turn Off Time (toff): 720 ns

The fast turn-off time helps prevent shoot-through currents in switching applications.

Maximum Feedback Capacitance (Crss): 100 pF

The low feedback capacitance minimizes signal distortion and improves overall performance.

Technical Specifications

Power Field Effect Transistors (FET) MTP12N08EZL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.18 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

100 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

720 ns

Maximum Turn On Time (ton):

630 ns

Trade Compliance

MTP12N08EZL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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