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MTP1N60E

Onsemi

MTP1N60E by Onsemi

MTP1N60E by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. It has a Max IDM of 3A and EAS of 45mJ, suitable for SWITCHING applications. The transistor operates in ENHANCEMENT MODE with a max power dissipation of 50W, making it ideal for high-power circuit designs.

Median Price

$0.411

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,578 parts In-Stock

1+ parts

-

100+ parts

$0.396

1k+ parts

$0.329

10k+ parts

$0.293

20,578

-

$0.396

$0.329

$0.293

DigiKey

USA . 20,578 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.500

10k+ parts

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20,578

-

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$0.500

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Verical

USA . 20,578 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.411

10k+ parts

$0.367

20,578

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-

$0.411

$0.367

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,284 parts In-Stock

1+ parts

$0.268

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1,284

$0.268

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Digiode

USA . 1,827 parts In-Stock

1+ parts

$0.309

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1,827

$0.309

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DigiKey Marketplace

USA . 20,578 parts In-Stock

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20,578

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Lantek

USA . 1,350 parts In-Stock

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1,350

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Resion

USA . 1,286 parts In-Stock

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1,286

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Inventory MP

USA . 188 parts In-Stock

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188

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Bristol Electronics

USA . 188 parts In-Stock

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188

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Semi Source

USA . 82 parts In-Stock

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82

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ECAB

Sweden . 5 parts In-Stock

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5

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R&J Components

USA . 4 parts In-Stock

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Prism Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 434 parts In-Stock

1+ parts

$0.268

100+ parts

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434

$0.268

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Corphita

USA . 1,630 parts In-Stock

1+ parts

$0.292

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1,630

$0.292

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Continental Prestige Electronics

USA . 20,578 parts In-Stock

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$0.298

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$0.298

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Kepictronics

USA . 15,000 parts In-Stock

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TANS Electronics

Latvia . 7,576 parts In-Stock

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7,576

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Kulean Microsystems

USA . 4,594 parts In-Stock

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4,594

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GreenTree Electronics

Israel . 1,350 parts In-Stock

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1,350

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Problanco Electronics

Mexico . 1,285 parts In-Stock

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SupplyDigital Components

Austria . 872 parts In-Stock

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UHIMA Technologies

Türkiye . 650 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Looking for a reliable power FET for your switching applications? Look no further than the MTP1N60E by Onsemi. With Onsemi's reputation for high-quality components, this N-channel FET offers enhanced performance and efficiency. Whether you're designing industrial equipment or consumer electronics, this transistor provides the power and reliability you need. Say goodbye to overheating and inefficiency with the MTP1N60E - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good thermal conductivity and electrical isolation, making the product reliable and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower ON-state resistance, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600V, this FET can handle higher voltages without breakdown, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 8 ohm

The low on-resistance of 8 ohms ensures minimal power loss and efficient switching performance in the circuit.

Maximum Power Dissipation (Abs): 50 W

The high power dissipation rating of 50W allows the FET to handle high power levels without overheating, ensuring reliability in operation.

Maximum Operating Temperature: 150 °C

The FET can operate at temperatures up to 150 °C, making it suitable for a wide range of industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) MTP1N60E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

45 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

3 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP1N60E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-14-475-7701, 5961144757701

NIIN

144757701

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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