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MTD6P10E

Onsemi

MTD6P10E by Onsemi

MTD6P10E by Onsemi is a P-CHANNEL FET with 100V DS Breakdown Voltage, 18A IDM, and 0.66 ohm RDS. Ideal for SWITCHING applications, it features ENHANCEMENT MODE operation in a PLASTIC/EPOXY package with GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

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Speed Components Ltd

Israel . 2,200 parts In-Stock

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Vyrian

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Digiode

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PC Components Company LLC

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Bristol Electronics

USA . 240 parts In-Stock

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North Shore Components

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Mil-Aero Solutions, Inc.

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R&J Components

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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LWI Electronics Inc

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LittleDiode

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Kepictronics

USA . 13,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

Latvia . 7,919 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,909 parts In-Stock

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SupplyDigital Components

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Problanco Electronics

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Assy Fe

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Kulean Microsystems

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UHIMA Technologies

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Corohmni

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Overview

Unlock the power of cutting-edge technology with the MTD6P10E by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power FETs that exceed expectations. This P-Channel transistor offers enhanced performance for switching applications, providing a seamless experience for customers. With a maximum pulsed drain current of 18A and a compact rectangular package design, this transistor is versatile and efficient. Trust Onsemi to deliver reliable products that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high input impedance, low input capacitance, and ease of use in various circuit configurations, making this product suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps with reverse current protection and allows for easier circuit design, making this FET a convenient choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and efficient power management.

Surface Mount: YES

Being surface mountable allows for easy and compact integration onto circuit boards, saving space and simplifying assembly processes.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage of 100V ensures reliable operation and protection against voltage spikes in the circuit.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on PCBs, maximizing space utilization and enabling neat and organized circuit layouts.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering onto PCBs, ensuring secure connections and reliable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers simple control over the FET's switching behavior, making it easier to use in various circuit configurations.

Maximum Pulsed Drain Current (IDM): 18 A

The high maximum pulsed drain current capability of 18A enables the FET to handle sudden surges of power, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 180 mJ

The high avalanche energy rating of 180mJ ensures robust performance and protection against overvoltage conditions, enhancing the reliability of the FET.

Maximum Drain Current (Abs) (ID): 6 A

With a maximum drain current of 6A, this FET can handle moderate power loads efficiently, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 50 W

The high maximum power dissipation rating of 50W allows the FET to handle significant power levels without overheating, ensuring reliable operation in demanding conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, reduces overall size and weight of the product, and facilitates thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and compatibility with various circuit designs, making this FET a versatile choice for different applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows the FET to withstand elevated temperatures without performance degradation, ensuring reliable operation in challenging environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability, stability, and efficiency, making it a suitable choice for the construction of power FETs.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliable electrical connections, ensuring the FET can be easily integrated into circuit designs.

Maximum Drain-Source On Resistance: 0.66 ohm

The low drain-source on resistance of 0.66 ohm results in minimal power loss and efficient power delivery, making this FET suitable for high-performance applications.

Terminal Position: SINGLE

Having a single terminal position simplifies the connection process and ensures correct placement on PCBs, facilitating ease of use and assembly.

Case Connection: DRAIN

The drain case connection provides easy access to the drain terminal, enabling convenient connection and efficient heat dissipation in the circuit.

Peak Reflow Temperature °C: 235

The high peak reflow temperature of 235 °C ensures reliable soldering and proper bonding of the FET during assembly processes, enhancing overall product quality and longevity.

Technical Specifications

Power Field Effect Transistors (FET) MTD6P10E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.66 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTD6P10E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-456-1086, 5961014561086

NIIN

014561086

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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