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MTD6N151

Onsemi

MTD6N151 by Onsemi

MTD6N151 by Onsemi is a N-CHANNEL FET with 150V DS breakdown voltage and 20A IDM. Ideal for switching applications, it has a single configuration with built-in diode and operates in enhancement mode. With a max power dissipation of 20W, this MOSFET is suitable for high-power electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,802 parts In-Stock

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Vyrian

USA . 420 parts In-Stock

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Problanco Electronics

Mexico . 5,566 parts In-Stock

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SupplyDigital Components

Austria . 4,517 parts In-Stock

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TANS Electronics

Latvia . 4,456 parts In-Stock

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Kulean Microsystems

USA . 4,282 parts In-Stock

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UHIMA Technologies

Türkiye . 730 parts In-Stock

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Corphita

USA . 271 parts In-Stock

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Corohmni

South Africa . 231 parts In-Stock

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Overview

Unlock the power of your electronics with the MTD6N151 Power Field Effect Transistor by Onsemi. Designed for switching applications, this N-CHANNEL transistor offers a reliable and efficient solution for your projects. With a maximum drain current of 6A and a minimum DS breakdown voltage of 150V, this transistor ensures optimal performance and durability. Whether you're working on industrial equipment or automotive systems, the MTD6N151 delivers exceptional quality and value, making it the ideal choice for your next project. Trust Onsemi's expertise in semiconductor technology and elevate your designs with this high-performance transistor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the FET, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high-power applications due to their lower on-state resistance, making this FET a suitable choice for switching applications.

Minimum DS Breakdown Voltage: 150 V

The high minimum breakdown voltage of 150V allows this FET to handle higher voltages safely, ideal for applications where voltage spikes may occur.

Maximum Drain Current (Abs) (ID): 6 A

With a maximum drain current of 6A, this FET can handle moderate power requirements effectively, making it suitable for a variety of switching applications.

Maximum Power Dissipation (Abs): 20 W

The high maximum power dissipation of 20W ensures that this FET can handle high power loads without overheating, providing reliable performance in demanding conditions.

Maximum Operating Temperature: 150 °C

The maximum operating temperature of 150 °C allows this FET to operate efficiently in high-temperature environments, making it suitable for industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high speed and low power consumption, making this FET a great choice for applications that require fast switching and low energy consumption.

Maximum Drain-Source On Resistance: 0.3 ohm

The low drain-source on resistance of 0.3 ohms minimizes power losses and improves efficiency in the FET, making it suitable for high-frequency switching applications.

Technical Specifications

Power Field Effect Transistors (FET) MTD6N151 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTD6N151 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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