Loading...

MPN3700RL

Onsemi

MPN3700RL by Onsemi

The Onsemi MPN3700RL is a PIN diode with 1 pF capacitance, 1 ohm forward resistance, and 0.28 W power dissipation. It operates in the very high frequency band for switching applications at up to 125 °C. The diode has a breakdown voltage of 200 V and uses positive-intrinsic-negative technology in a cylindrical package with tin lead terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,362

-

-

-

-

Vyrian

USA . 291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

291

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,110

-

-

-

-

SupplyDigital Components

Austria . 6,439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,439

-

-

-

-

Problanco Electronics

Mexico . 5,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,045

-

-

-

-

Kulean Microsystems

USA . 4,932 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,932

-

-

-

-

Corphita

USA . 2,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,091

-

-

-

-

Corohmni

South Africa . 307 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

307

-

-

-

-

UHIMA Technologies

Türkiye . 199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

199

-

-

-

-

Overview

Discover the power of the MPN3700RL PIN Diode by Onsemi, a versatile component that offers high-quality performance in very high frequency applications. With a maximum diode capacitance of 1 pF and a minimum breakdown voltage of 200 V, this single-configured diode is perfect for switching tasks. Its cylindrical package shape and tin lead terminal finish ensure durability and reliability, making it a valuable addition to any project. Trust Onsemi's reputation for excellence and unlock the potential of the MPN3700RL in your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making it ideal for various applications.

Config: SINGLE

Simplifies circuit design and integration, reducing overall complexity and cost.

Frequency Band: VERY HIGH FREQUENCY

Suitable for high-frequency applications, offering efficient signal processing and communication.

Maximum Diode Capacitance: 1 pF

Low capacitance allows for fast switching speeds and high-frequency operation.

Package Shape: ROUND

Provides uniform distribution of stress, enhancing reliability and performance.

No. of Terminals: 2

Simplifies connectivity and installation, reducing the chances of errors.

Package Style (Meter): CYLINDRICAL

Facilitates easy handling and mounting in various systems or devices.

Application: SWITCHING

Designed for efficient switching operations, offering high-speed performance and low power consumption.

Maximum Operating Temperature: 125 °C

Provides a wide temperature range for versatile use in different environments.

Terminal Finish: TIN LEAD

Ensures good electrical conductivity and solderability for reliable connections.

Terminal Position: BOTTOM

Facilitates easy PCB layout and integration into existing systems.

Maximum Diode Forward Resistance: 1 ohm

Offers low resistance for efficient signal transmission and power dissipation.

Maximum Power Dissipation: 0.28 W

Allows for high power handling capability, making it suitable for demanding applications.

Minimum Breakdown Voltage: 200 V

Withstands high voltages, offering robust protection and reliability in operation.

Diode Type: PIN DIODE

Well-suited for RF applications, providing fast switching and low distortion.

Technology: POSITIVE-INTRINSIC-NEGATIVE

Utilizes this specific diode structure for high performance and efficiency.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and mounting on the PCB without requiring special equipment.

Diode Element Material: SILICON

Offers good conductivity and reliability, ensuring long-term performance and durability.

Technical Specifications

PIN Diodes MPN3700RL attributes and parameters. Explore more PIN Diodes devices from Onsemi

Specs

Additional Features:

EUROPEAN PART NUMBER

Application:

SWITCHING

Minimum Breakdown Voltage:

200 V

Config:

SINGLE

Maximum Diode Capacitance:

1 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

1 ohm

Diode Type:

Frequency Band:

VERY HIGH FREQUENCY

JEDEC-95 Code:

TO-92

JESD-30 Code:

O-PBCY-T2

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CYLINDRICAL

Maximum Power Dissipation:

.28 W

Qualification:

Not Qualified

Surface Mount:

NO

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

Trade Compliance

MPN3700RL Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20