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MCH6341-TL-H

Onsemi

MCH6341-TL-H by Onsemi

The Onsemi MCH6341-TL-H is a P-CHANNEL FET with 5A max drain current and 1.5W power dissipation. Ideal for applications requiring high temperature resistance up to 150 °C, such as power management in automotive or industrial electronics.

Median Price

$0.170

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,328,797 parts In-Stock

1+ parts

$0.170

100+ parts

$0.170

1k+ parts

$0.160

10k+ parts

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1,328,797

$0.170

$0.170

$0.160

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,089 parts In-Stock

1+ parts

$0.162

100+ parts

-

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2,089

$0.162

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Vyrian

USA . 1,089 parts In-Stock

1+ parts

$0.170

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1,089

$0.170

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,491 parts In-Stock

1+ parts

$0.153

100+ parts

-

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2,491

$0.153

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Corohmni

South Africa . 343 parts In-Stock

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$0.170

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343

$0.170

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Component Stockers USA

USA . 761 parts In-Stock

1+ parts

$99.990

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761

$99.990

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Kepictronics

USA . 94,000 parts In-Stock

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94,000

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Metaverse IC Inc.

Canada . 94,000 parts In-Stock

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94,000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,400 parts In-Stock

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10,400

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TANS Electronics

Latvia . 6,372 parts In-Stock

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6,372

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SupplyDigital Components

Austria . 5,918 parts In-Stock

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5,918

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Kulean Microsystems

USA . 5,517 parts In-Stock

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5,517

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Perfect Parts

USA . 3,248 parts In-Stock

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3,248

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Problanco Electronics

Mexico . 1,960 parts In-Stock

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1,960

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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162

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Overview

Upgrade your power systems with the MCH6341-TL-H by Onsemi, a top-quality P-CHANNEL Power FET that offers unparalleled reliability and performance. Manufactured by industry-leading Onsemi, this single-channel FET is designed for surface mount applications and can handle a maximum drain current of 5A and power dissipation of 1.5W. Perfect for a wide range of applications, including power management and voltage regulation, this FET ensures optimal efficiency and durability. Trust Onsemi's expertise and elevate your projects with the MCH6341-TL-H today!

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance and high gate-source voltage, making them suitable for applications requiring low power consumption and high efficiency.

Configuration: SINGLE

Single configuration allows for easier circuit design and integration, making the product suitable for simple applications.

Surface Mount: YES

Surface mount technology enables compact and lightweight designs, making the product suitable for applications with space constraints.

Maximum Drain Current (Abs) (ID): 5 A

With a high maximum drain current, this FET can handle high power loads, making it suitable for applications requiring high current capabilities.

Maximum Power Dissipation (Abs): 1.5 W

With a high maximum power dissipation, this FET can handle heat efficiently, making it suitable for applications where heat dissipation is important.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics such as high input impedance and low input capacitance, making the product suitable for various applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures, making it suitable for applications in harsh environments.

Terminal Finish: TIN BISMUTH

Tin bismuth terminal finish provides good solderability and reliability, making the product suitable for manufacturing processes and long-term use.

Maximum Time At Peak Reflow Temperature (s): 30

With a short maximum time at peak reflow temperature, the product is more resistant to thermal stress during assembly processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand high temperature soldering processes, ensuring reliable solder joints.

Technical Specifications

Power Field Effect Transistors (FET) MCH6341-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MCH6341-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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