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MCH6307

Onsemi

MCH6307 by Onsemi

The Onsemi MCH6307 is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 20A and ID of 5A, with 0.046 ohm RDS(ON). Operating in ENHANCEMENT MODE, it has a max temp of 150 °C and comes in a SMALL OUTLINE package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,592 parts In-Stock

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Digiode

USA . 1,086 parts In-Stock

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Assy Fe

Spain . 9,700 parts In-Stock

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TANS Electronics

Latvia . 8,019 parts In-Stock

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SupplyDigital Components

Austria . 6,932 parts In-Stock

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Problanco Electronics

Mexico . 4,534 parts In-Stock

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Kulean Microsystems

USA . 2,302 parts In-Stock

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Corphita

USA . 1,958 parts In-Stock

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UHIMA Technologies

Türkiye . 629 parts In-Stock

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Corohmni

South Africa . 470 parts In-Stock

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Overview

Upgrade your power system with the MCH6307 by Onsemi, a high-quality Power FET that delivers exceptional performance and reliability. Perfect for switching applications, this P-Channel transistor offers a built-in diode for added convenience. With a maximum operating temperature of 150 °C and a minimum DS breakdown voltage of 12V, this transistor ensures efficient power management. Trust in Onsemi's expertise in semiconductor technology to provide you with a reliable solution for all your power needs. Experience the benefits of enhanced power efficiency and performance with the MCH6307.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring it can withstand various environmental conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs typically have lower on-resistance and higher current handling capabilities compared to N-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and protects the FET from voltage spikes or reverse currents, enhancing the reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power consumption, making it ideal for energy-efficient designs.

Surface Mount: YES

The surface-mount capability allows for easy and efficient PCB assembly, saving space and reducing manufacturing time and costs.

Minimum DS Breakdown Voltage: 12 V

The 12V breakdown voltage ensures reliable operation under typical voltage conditions, protecting the FET from potential damage.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor, making it compatible with various mounting and assembly setups.

Terminal Form: FLAT

The flat terminal form allows for easy soldering connections and improved thermal performance, ensuring efficient heat dissipation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control and can be used in a wider range of applications, providing flexibility and versatility in circuit design.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current capability allows the FET to handle short-duration high-current loads, making it suitable for power electronics applications.

Maximum Drain Current (Abs) (ID): 5 A

The 5A maximum drain current ensures reliable operation under continuous load conditions, offering consistent performance over extended periods.

No. of Terminals: 6

The 6 terminals provide connection points for various circuit configurations, offering flexibility in design and compatibility with different systems.

Maximum Power Dissipation (Abs): 2 W

The 2W power dissipation rating ensures that the FET can handle heat generated during operation, maintaining stable performance and reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs and applications with limited board real estate.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high switching speeds, low on-resistance, and high power efficiency, making it suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

The 150 °C maximum operating temperature allows the FET to withstand high-temperature environments, ensuring reliable performance in demanding conditions.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its high electrical conductivity and stability, ensuring consistent performance and long-term reliability.

Maximum Drain Current (ID): 5 A

The 5A maximum drain current rating ensures that the FET can handle high-current loads, making it suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.046 ohm

The low on-resistance of 0.046 ohms minimizes power loss and heat dissipation, improving efficiency and reducing operating costs.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit configurations and layout designs, enabling versatile and customized applications.

Technical Specifications

Power Field Effect Transistors (FET) MCH6307 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

12 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MCH6307 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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