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MCH6341-TL-E

Onsemi

MCH6341-TL-E by Onsemi

MCH6341-TL-E by Onsemi is a P-CHANNEL FET with 5A max drain current and 1.5W power dissipation. Ideal for applications requiring high temperature resistance up to 150 °C, such as power management in electronic devices.

Median Price

$1.065

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 2,500 parts In-Stock

1+ parts

$1.892

100+ parts

$1.722

1k+ parts

$1.551

10k+ parts

-

2,500

$1.892

$1.722

$1.551

-

Rochester

USA . 332 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

332

-

$0.238

$0.197

$0.176

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,569 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

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1,569

$0.185

-

-

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Vyrian

USA . 1,263 parts In-Stock

1+ parts

$0.195

100+ parts

-

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1,263

$0.195

-

-

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Euro-Tech

UK . 2,440 parts In-Stock

1+ parts

-

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2,440

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-

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Cyclops Electronics Ltd

UK . 2,434 parts In-Stock

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2,434

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 65 parts In-Stock

1+ parts

$0.176

100+ parts

-

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-

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65

$0.176

-

-

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Corohmni

South Africa . 326 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

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326

$0.195

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.892

100+ parts

$1.722

1k+ parts

$1.551

10k+ parts

-

2,500

$1.892

$1.722

$1.551

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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15,000

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Kepictronics

USA . 7,532 parts In-Stock

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7,532

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QUARKTWIN TECHNOLOGY LTD

USA . 7,163 parts In-Stock

1+ parts

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7,163

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TANS Electronics

Latvia . 6,325 parts In-Stock

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6,325

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Metaverse IC Inc.

Canada . 5,600 parts In-Stock

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5,600

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Kulean Microsystems

USA . 4,663 parts In-Stock

1+ parts

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4,663

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A-Z Elektronik GmbH

Germany . 2,859 parts In-Stock

1+ parts

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2,859

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SupplyDigital Components

Austria . 2,536 parts In-Stock

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2,536

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Perfect Parts

USA . 1,674 parts In-Stock

1+ parts

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100+ parts

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1,674

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UHIMA Technologies

Türkiye . 584 parts In-Stock

1+ parts

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100+ parts

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584

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Problanco Electronics

Mexico . 322 parts In-Stock

1+ parts

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1k+ parts

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322

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Overview

Unlock the power of innovation with the MCH6341-TL-E P-CHANNEL Power Field Effect Transistor from Onsemi. Designed for efficiency and reliability, this single configuration transistor offers a maximum drain current of 5A and a maximum power dissipation of 1.5W. Ideal for a variety of applications, this transistor utilizes metal-oxide semiconductor technology and can operate at temperatures up to 150 °C. With tin bismuth terminal finish and surface mount capabilities, this high-quality component provides exceptional value and performance for your projects. Elevate your designs with Onsemi's MCH6341-TL-E today.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low resistance and high efficiency, making them suitable for power applications.

Configuration: SINGLE

Single configuration FETs are simple to use and are often more cost-effective than multiple configuration FETs.

Surface Mount: YES

Surface mount FETs are easier to integrate into circuit boards and provide space-saving benefits.

Maximum Drain Current (Abs) (ID): 5 A

With a high maximum drain current, this FET can handle a significant amount of power, making it suitable for various applications.

Maximum Power Dissipation (Abs): 1.5 W

The low maximum power dissipation ensures that the FET operates efficiently and minimizes heat generation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides good performance and reliability in power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance.

Terminal Finish: TIN BISMUTH

The tin bismuth terminal finish offers good solderability and reliability in different environmental conditions.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps prevent damage to the FET during soldering processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability of the FET in various manufacturing processes.

Technical Specifications

Power Field Effect Transistors (FET) MCH6341-TL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MCH6341-TL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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