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MCH6342-TL-H

Onsemi

MCH6342-TL-H by Onsemi

The Onsemi MCH6342-TL-H is a P-CHANNEL FET with 4.5A max drain current and 1.5W power dissipation. Ideal for applications requiring high temperature tolerance up to 150 °C, such as power management in electronic devices.

Median Price

$0.563

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2,457 parts In-Stock

1+ parts

$0.563

100+ parts

$0.208

1k+ parts

$0.146

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2,457

$0.563

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$0.146

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ACDS - Activité Composants Distribution Service

France . 2,457 parts In-Stock

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Dan-Mar Components

USA . 2,457 parts In-Stock

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2,457

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Vyrian

USA . 1,065 parts In-Stock

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Digiode

USA . 845 parts In-Stock

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845

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Distributors (Availability)

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$1.358

100+ parts

$1.236

1k+ parts

$1.114

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40

$1.358

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$1.114

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Kepictronics

USA . 85,400 parts In-Stock

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Metaverse IC Inc.

Canada . 85,400 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 28,231 parts In-Stock

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TANS Electronics

Latvia . 7,762 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,893 parts In-Stock

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Problanco Electronics

Mexico . 6,776 parts In-Stock

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Kulean Microsystems

USA . 6,090 parts In-Stock

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Corphita

USA . 2,314 parts In-Stock

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Perfect Parts

USA . 2,106 parts In-Stock

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Microchip USA

USA . 482 parts In-Stock

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Corohmni

South Africa . 408 parts In-Stock

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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SupplyDigital Components

Austria . 128 parts In-Stock

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Overview

Transform the way you power your devices with the MCH6342-TL-H P-Channel Power FET by Onsemi. Crafted with precision and quality, this FET offers unmatched performance and reliability for a wide range of applications. Whether you're looking to optimize power management in automotive systems or enhance efficiency in industrial equipment, this FET delivers superior results. Trust in Onsemi's reputation for excellence and experience the value and benefits this product brings to your projects. Elevate your power solutions with the MCH6342-TL-H.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high current carrying capacity, making them ideal for power management applications.

Configuration: SINGLE

Single configuration FETs are simpler to work with and offer better thermal performance compared to parallel configurations.

Surface Mount: YES

Surface mount FETs are easy to install and occupy less space on the PCB, making them suitable for compact electronic devices.

Maximum Drain Current (Abs) (ID): 4.5 A

With a high maximum drain current rating of 4.5 A, this FET can handle heavy loads efficiently without overheating.

Maximum Power Dissipation (Abs): 1.5 W

The low maximum power dissipation of 1.5 W ensures that the FET operates within safe temperature limits even under high load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high efficiency and fast switching speeds, making them suitable for power switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C allows the FET to perform reliably in harsh environmental conditions.

Terminal Finish: TIN BISMUTH

Tin-bismuth terminal finish provides good solderability and thermal performance, ensuring reliable electrical connections.

Technical Specifications

Power Field Effect Transistors (FET) MCH6342-TL-H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN BISMUTH

Trade Compliance

MCH6342-TL-H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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